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Home > Manufacturing & Processing Machinery > Laser Equipment > Laser Welding Machine > SP380II Rework Station With Laptop Motherboard Diagnostic for Toshiba /asus /vga Chip Repair
SP380II Rework Station With Laptop Motherboard Diagnostic for Toshiba /asus /vga Chip Repair
US$ 1 - 1
MOQ: 1 Set
Key Specifications
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Place of Origin:
Guangdong, China
Brand Name:
Shuttle Star
Model Number:
380II
Payment & Shipping
Payment Methods:
Port of Shipment:
shenzhen/hongkong
Delivery Detail:
Delivery time depends on order quantity.
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Place of Origin
Guangdong, China
Brand Name
Shuttle Star
Model Number
380II
Voltage
220V
Current
10A
Rated Capacity
4.5KVA
Rated Duty Cycle
100%
Dimensions
L660*W630*H600mm
Weight
Appox 60kg
Usage
BGA Rework, repair the chip on motherboard
Certification
CE ISO 9001 20008
After-sales Service Provided
Engineers available to service machinery overseas
Product Description
(RW-B400C / RW-380II) desktop/laptop/xbox/ps3 bga rework station
Specification:
BGA rework station (RW-B400C 380) | |
PCB dimension |
W50*50~W450*400mm |
PCB thickness |
0.5~4mm |
Working table adjustment |
+/-50mmforward/backward,+/-200mm left/right |
Temperature control |
K-type thermocouple, close cycle controlled |
PCB locating way |
Jip |
Area heater |
Infrared 2700w |
Top heater |
Hot gas 400w |
Bottom preheat |
Hot gas 800w |
Power supply |
Single-phase 220,50/60Hz. 4.5kw |
Machine dimension |
L660*W630*H600mm |
Machine weight |
Approx. 60kgs |
PLC control,realtime temperature curve display,
able to display temperature curves and detecting curves at the same time;
Adjustable PCB positioning support, enables easy and fast positioning of the PCB board .
The supports for the BGA soldering supporting frame are mirco-adjustable to restrain local sinkage
1. Made of quality heating material;desoldering and solding procedures of BGA are precisely controlled;
2. The movable heating head,which is able to move freely horizontally,is easy to be operated;
3. The temperature of the upper and lower hot air guns can be precisely controlled according to their spectific
temperature, the infrared constant temperature heating zone at the lower part and the appropriate
temperature-control settings make the rework safer and more reliable .
4.Powerful cross flow fans cool the lower heating area rapidly.
5.Buzz after solding is finished or desoldering;hand vacuum pen is adjustable for removing BGA;
6.Both the upper and lower parts are equipped with over temperature alarming and protection apparatus.
17.With different alloy hot gas nozzles,easy to replace, it could be tailored as per the specific requirements.
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Business Type
Manufacturer
Year Established
2000
Factory Size
1,000-3,000 square meters
Total Employees
51 - 100 People
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