SP380II Rework Station With Laptop Motherboard Diagnostic for Toshiba /asus /vga Chip Repair
(RW-B400C / RW-380II) desktop/laptop/xbox/ps3 bga rework station
Specification:
BGA rework station (RW-B400C 380) | |
PCB dimension | W50*50~W450*400mm |
PCB thickness | 0.5~4mm |
Working table adjustment | +/-50mmforward/backward,+/-200mm left/right |
Temperature control | K-type thermocouple, close cycle controlled |
PCB locating way | Jip |
Area heater | Infrared 2700w |
Top heater | Hot gas 400w |
Bottom preheat | Hot gas 800w |
Power supply | Single-phase 220,50/60Hz. 4.5kw |
Machine dimension | L660*W630*H600mm |
Machine weight | Approx. 60kgs |
PLC control,realtime temperature curve display,

The supports for the BGA soldering supporting frame are mirco-adjustable to restrain local sinkage
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