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Best Price Laser Welding Machine Pick and Place Bga Chip for Sony/htc Motherboard

Shenzhen Shuttle Star Industrial Co., Ltd.
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US$ 1 - 1 MOQ: 1 Set
Key Specifications
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Place of Origin:
Guangdong, China
Brand Name:
Shuttle Star
Model Number:
SP360C
Contact Supplier Request Quote Chat Now
Payment & Shipping
Payment Methods:
Port of Shipment:
shenzhen/hongkong
Delivery Detail:
Delivery time depends on order quantity.

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Place of Origin Guangdong, China
Brand Name Shuttle Star
Model Number SP360C
Voltage 220V
Current 10A
Rated Capacity 4KW
Rated Duty Cycle 100%
Dimensions L550*W610*H585mm
Weight 33kg
Usage BGA Rework
Certification ROHS
After-sales Service Provided Engineers available to service machinery overseas

Best price laser welding machine pick and place bga chip for sony/ htc motherboard

 

 

Product Description

 

Specification

Applicable PCB SizeW50mm*D50mm~W400mm*D380mm
Applicable BGA Size7mm*7mm~55mm*55mm
Max BGA Weight80g
Upper heater(Hot Air)600w
Lower heater(Hot Air)800w
Bottom Preheat IR heater2400w
Machine Dimension550mm*610mm*585mm
Machine Weight33KG
Power supplyAC 220V 4KW

 

Best price laser welding machine pick and place bga chip for sony/htc motherboard

Three temperature zone of our BGA rework station:

 

1) Top hot air heater

 

2) Bottom hot air heater 

 

3) Bottom IR preheat

Best price laser welding machine pick and place bga chip for sony/htc motherboard

 

Equipped with vacuum pen to pick up BGA

 

Best price laser welding machine pick and place bga chip for sony/htc motherboard

Best price laser welding machine pick and place bga chip for sony/htc motherboard

 

 

Special clapms help to fix the PCB motherboard

 

Best price laser welding machine pick and place bga chip for sony/htc motherboard

  

 

Real-time temperature curve can be displayed on operation interface

Best price laser welding machine pick and place bga chip for sony/htc motherboard

 With different alloy hot gas nozzles, suit for different kind of BGA

 

Best price laser welding machine pick and place bga chip for sony/htc motherboard

 

 

 Other Features

 1. Made of high quality heating material; desoldering and soldering procedures of BGA are precisely      controlled;

 2. Movable heating head, which is able to move freely horizontally, easy to operated;
 3. Embedded industrial computer, PLC control, real-time profile display, able to display set profile
 and practically-tested profile; big size screen, easy to operate;
 4. Profile saving no limit in this industrial computer, can analyze the two practically-tested profiles,
 can input both English and Chinese;
 5. The temperatures of the upper and lower hot air heaters can be precisely controlled according to
  their specific temperatures. The infrared constant temperature heating zone at the bottom area and
  the appropriate temperature-control settings make the rework safer and more reliable.
 6. The supports for the BGA soldering supporting frame are micro-adjustable to restrain local  sinkage.
 7. Powerful cross flow fans cool the lower heating area rapidly;
 8. The adjustable PCB positioning support, onto which the special fixtures for alloyed board could be    installed,enables easy and fast positioning of the PCB board;
 9. Buzz after soldering is finished or desoldering; Hand vacuum pen is adjustable for removing BGA;
10.Both the upper and lower parts are equipped with over-temperature alarming and protection  apparatus.
11.With different alloy hot gas nozzles, easy to replace. It could be tailored as per the specific requirements.
12.The integrated design of machine and chassis is room-saving. could be altered to instrument-control.
13.The software can be updated to auto-profile in future by USB, no need to set profiles.

 

 

Company Information

  Shuttle star industrial Co.,Ltd ,the company expert in bga rework station for 17years, the reliability and technology deposit are all recognized at home

and abroad,so if you are looking for bga rework station, we are definitely your

best choice.

 

Best price laser welding machine pick and place bga chip for sony/htc motherboardBest price laser welding machine pick and place bga chip for sony/htc motherboard

 

 

 

Packaging & Shipping

1, All machines will be packaged in wooden box if the buyers ask no special demand.

2, It is free shipping in mainland.

3,Shipping by DHL,UPS,TNT,EMS,by air or sea,we will choose the best for you.

Best price laser welding machine pick and place bga chip for sony/htc motherboard

Our Services

 1, Warranty: one year.

 2, Service hot line: 24 hours all round year

 3, Spot goods: 3 million sets.

 4, Delivery date: with 7 business days after receiving the payment.

 5,Payment terms: Bank Transfer,Paypal,West Union,T/T,etc.

 

If you want to konw more,please contact us.

Thanks for your time!

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Shenzhen Shuttle Star Industrial Co., Ltd.
Business Type
Manufacturer
Year Established
2000
Factory Size
1,000-3,000 square meters
Total Employees
51 - 100 People
Contact Supplier Request Quote Chat Now

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