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Dinghua DH-A2 BGA Rework Station Mobile IPhone Chipset Repair

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US$ 4,000 - 6,000 MOQ: 1 Piece
Key Specifications
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Place of Origin:
Guangdong, China
Brand Name:
Dinghua
Model Number:
DH-A2
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Shenzhen Dinghua Technology Development Co., Ltd.
Payment & Shipping
Payment Methods:
Port of Shipment:
Shenzhen
Delivery Detail:
Delivery time depends on order quantity.

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Place of Origin Guangdong, China
Brand Name Dinghua
Model Number DH-A2
Voltage AC220V±10%
Current 20A
Rated Capacity 5200W
Rated Duty Cycle 90%
Dimensions L600*W700*H850MM
Weight 70kg
Usage repair all kinds of bga chip set
Certification CE, ROHS, UL
After-sales Service Provided Engineers available to service machinery overseas
Product Description

DH-A2 BGA Rework Statio

This is an high efficiency BGA rework station for repairing motherboard IC/Chip/Chipset of Laptop, Mobile, PC, iPhone, Xbox, etc. with features 3-heater(2xHot air+IR Preheating), embedded Smart PC, Auto Profile, Optical Alignment, etc. Easy operation with "ONE-Button Desoldering", Fast Positioning, Cooling System, Micro adjustment, Auto Pick-up & Place, Universal Support for most of the PCB Size/Shape.

SPECIFICATIONS
Total Power
5200W
Top heater Power
1200W (1st Hot air heater)
Bottom Heater
1200W(2nd hot air heater), 3000W (IR preheat)
Temperature Accuracy
+/- 1C
Power Supply
AC 220V 50/60Hz (AC 110V optional)
Dimension
600x700x850mm (L*W*H)
Temperature Profile Storage
100,000 groups
Operation Mode
Auto+Manual+Touchscreen+Joysticks
CCD Lens for optical alignment 
90 dgree Open/Folding
PCB Support
V-groove + universal fixture + 5-points support + Adjustable in X/Y direction
BGA Positioning
Optical Alignment + Laser point assisting + Micrometer adjust
Positioning Accuracy
0.01mm
Temperature Control
K-type Thermocouple + Closed Loop + Auto compensation
PCB Size
Max.450x400mm, Min. 22x22mm
BGA Chip
2x2mm-80x80mm
Minimum Chip Spacing
0.1mm
External connector for temperature testing
1pcs or Customized
Net Weight
70kg
Main Features

1, Smart PC (the brain of machine)

1) PLC system, Human-machine interface with Touch screen for easy operation and high accuracy rework.

2) Manage the temperature profile: Setting, Storage, Apply, Analysis, Debug. Up to 16-segments temperature control, 100,000 groups storage for different BGA's rework temperature profile.

3) Control the machine's run.


2, Three Independent Heaters (3 temp zones)

1) Top Hot Air + Bottom Hot Air + IR infrared preheating platform. The top and bottom can be adjusted UP/Down.
2) Independent temperature control with 3 temperature profile.
3) Controlled by the Control PC.
4) Reliable, Stable and Precise heating process.

3, Optical Alignment

Name: CCD camara Lens
Brand: Pansonic
Original: Japan
1) Highly increase the Accuracy of Chip soldering, Fast Placement, make rework process easier.

2) Control by PC, auto Folding and Open

3) Displayed on HD LCD Screen

4, Universeral PCB Support

1) V-groove Slot + 5-point support to fix the PCB.

2) Universal Fixture with adjustment in X/Y direction for various PCB.

3) Micrometer to adjust the PCB position in 0.01mm accuracy.

4) All for reliable, accurate, fast positioning and fixture.

5, Auto Pick-up&Placement

Built-in Vacuum Pump, integrate the Vacuum Sucker in the Top heater, control by the PC to Pick-up and Placement automatically, 

6, Nozzle with Reflow Vent

1) All the Nozzles are made by Titanium Alloy.

2) Top Nozzle has Reflow Vent to prevent the damage to surrounding components.

3) Magnetic Nozzle, Easy to install / adjust / change.

7, Temperature Control

K Thermocouple + Closed Loop + PID Auto Temperature Compensation make the temperature accuracy within 1° Celsius.

9, Manual & Automatic Mode

1) Manual: Joystick to control the Top Heater with the assist of Laser point and Optical alignment.

2) Automatic: "One button" for desoldering with PC Controller

8, Cooling Fan

1) Cross air flow to cooling the PCB after heating, it is important for prevent deformation

2) Auto Cooling after the heating complete.

9, Laser Point

Assist positioning, adjust the pcb to make sure the laser point(red) is on the center of BGA Chip.

10, LED Light

A high Power LED light with flexible tube will give you a bright rework, remember that darkness is also a deadly enemy for BGA rework.

Certifications
Packing & Delivery
Packaging
Size
82(L) * 77 (W) * 87(D)
Weight
100Kg



Packaging Details
The normal package is wooden box(Size: L*W*H). If export to european countries,the wooden box will be fumigated.If container is too tigher,we will use pe film for packing or pack it according to customers special request.
Our Service

1) OEM acceptable

2) 1 year warranty & 3 year for heating wire.

3) Demo video provided.

4) Welcome to Visit our factory.

5) Reply within 12h

Our Company

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Shenzhen Dinghua Technology Development Co., Ltd.
Business Type
Manufacturer
Year Established
2011
Factory Size
1,000-3,000 square meters
Annual Export Value
US$2.5 Million - US$5 Million
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