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K4B1G1646E-HCF7(SamsungSemiconductor)Original
- 45100 Piece / Pieces per Month
- Shenzhen/Hongkong
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Product Details
D/C: | 2014+ | Package: | original | Model Number: | K4B1G1646E-HCF7(SamsungSemiconductor) |
Type: | Other, DRAM/CMOS Image Sensor/Flash Solution/System Logic/Mobile Memory | Brand Name: | SamsungSemiconductor | Place of Origin: | Gyeongsangnam-do, South Korea |
Product Description
Specifications
1.hot sale K4B1G1646E-HCF7(SamsungSemiconductor)2.New&Original
3.Best price,Excellent quality
4.In stock,Fast delivery
Product Description
Please let us know if you would like to know more about K4B1G1646E-HCF7(SamsungSemiconductor)Original. Please feel free to contact us.
DRAM
ComputingDRAM CosumerDRAM GraphicDRAM
CMOS Image Sensor
Flash Solution
System Logic
DisplaySolution Security Solution Power IC
Mobile Memory
Solution by Application
Computing Devices Mobile Devices Cosumer Devices Security Solution
Home -Product -Mobile Memory
Mobile Memory
Mobile DRAM and Multi-Chip Packages (MCPs)
SamsungMobile memory enables outstanding design flexibility. Mobile DRAM solutions help designers create sleek devices with heightened functionality. And, innovative "chip-stack" MCP solutions optimize board space by combining different memory technologies on a single substrate.
- ordering info : see below for part no. speed suffix
- K4XXXXXXX-[Suffix]
1. temperature
2. speed for Mobile-SDRAM
Part No. Suffix | Description |
C3 | 133MHz, CL3 |
C6 | 166MHz, CL3 |
C8 | 200MHz, CL3 |
CA | 111MHz, CL3 |
ICC1 @ Max.frequency, CL33. mobile function
- PASR : Partial Array Self Refresh
- TCSR : Temperature Compensated Self Refresh
- DS : Drive Strength Control
4. current
- ICC6 @ Low, Full Bank, 85°C / 70°C
5. lead-free & halogen-free package
- K4XXXXXXXX-XXXXX (Xth code represents a package)
2 : 90FBGA (DDP)
3 : 90FBGA (lead-free & halogen-free, DDP)
4 : 96FBGA
5 : 96FBGA (lead-free & halogen-free)
7 : 90FBGA
8 : 90FBGA (lead-free & halogen-free)
A : 168FBGA (lead-free, halogen-free, DDP)
F : 60FBGA (lead-free & halogen-free)
M : 152FBGA (lead-free & halogen-free, POP)
N : 168FBGA (lead-free & halogen-free, POP)
P : 60FBGA (lead-free & halogen-free, DDP)
Y : 60FBGA (DDP)
Mobile DRAM
High-speed, power-saving memory for the next generation of mobile devices
Find out why leading manufacturers utilize Mobile DRAM for eBooks, tablet computers, smart phones, MP3s, and PDAs. Deliver the features you need to confidently meet market demand for handheld devices with high-performance memory built specifically for the leading edge of mobile device and application design.
Gain exceptional design advantages
Benefits of using Mobile DRAM in computing, consumer, and communication devices include:
- Reduced power consumption in standby mode enabled by advanced, on-chip technologies such as temperature-compensated self-refresh (TCSR)
- Extended battery life in operational mode with power consumption as low as 1.2V
- High operational speeds that keep pace with today´s fast mobile CPUs and large displays, enabling users to power through demanding applications and multitasking
- Design flexibility with a choice of thin, small form-factor packages that occupy very little board space
Realize outstanding power savings
Boost battery life with new generations of Samsungmobile memory:
- Samsungis introducing the world´s first 30-nm class LPDDR3 for high peak bandwidth and outstanding energy efficiency
- Samsungs’ 20-nm class LPDDR2 is designed to deliver significant power savings compared to the previous-generation LPDDR1 - while heightening performance to bring full, high-definition viewing to virtually any mobile device.
- Gain additional power savings by moving from a dual-die package to a monolithic chip, keeping the same total density, enabling an overall improvement of up to 70 percent in power efficiency at the component level.
Our LPDDR2 and LPDDR3 are designed to extend the life of a seven-hour battery by about 45 minutes during typical mobile operation. For standby power, the savings are even more dramatic. For example, Samsungs LPDDR2 or LPDDR3 can add up to three days of standby battery life for a smart phone, which is a 23 percent improvement over LPDDR1 - from 12.5 to 15.4 days.
Take mobile electronics to new heights
Accelerate your time to market with advanced Mobile DRAM. Whether you are designing with tight space constraints or need a game-changing combination of low power and high performance, depend on to deliver leading solutions for an ever-changing market.*
MCP
SamsungMulti-Chip Packages
Innovative "chip-stack" design optimizes board space
Find out why leading manufacturers choose SamsungMulti-Chip Packages (MCPs) for applications where board space is extremely limited, such as smartphones and other mobile handsets, tablets, and multimedia players. MCP memory configurations are designed to support a growing list of device capabilities, expanding freedom and choice for users who want to do more with their mobile applications.
Unify memory technologies on a single substrate
SamsungMCPs combine different memory technologies, including single-level cell (SLC) NAND flash or eMMC and Mobile DRAM such as LPDDR1 (low-power DDR1) and LPDDR2 on a single substrate. This flexible approach is designed to deliver benefits including:
- Enhanced memory and overall system performance through tight coupling and close positioning of memory modules to establish the shortest interconnections possible in a small, high-density package
- Average 30 percent to 40 percent savings in board space for your end product through the stacking of several memory chips in a vertical configuration
- Minimized bill-of-materials count for simplified manufacturing and cost savings
- Accelerated time to market through rapid integration of MCP modules, speeding the pace of product development
The broad Samsung MCP portfolio includes a myriad of memory configurations, primarily with 2-, 3-, or 4-die packages. The most popular combinations are 1Gb+512Mb; 2Gb+1Gb; 4Gb+2Gb (NAND and Mobile DRAM); as well as new eMMC-based MCP (eMCP) combos such as 4GB eMMC + 4Gb MDDR, and 32GB eMMC + 8Gb LPDDR2. The newest-generation eMCP modules are designed to contain a combination of the fastest eMMC (embedded multimedia card), along with either MDDR or LPDDR2 memory.
Deploy the latest technology for mobile processors
SamsungMCPs optimize designs for a comprehensive range of new and evolving consumer electronic devices.
- Many SamsungMCPs are built using the company's low-power memory technology (flash and DRAM) so that mobile devices consume as little power as possible.
- Core SamsungMCP technology takes advantage of the company's expertise in wafer thinning, die stacking, and wire bonding.
- Memory included in SamsungMCPs is manufactured using highly advanced process technologies, including 20nm-class and 30nm-class.
- Consistent use of packaging and footprint makes it easy to scale between different SamsungMCP combinations.
For virtually any mobile phone, Samsungoffers a mass-produced MCP solution to enable the desired feature set. In fact, Samsunghas been qualified in many reference designs from top-tier chipset vendors. In addition, Samsungcan produce custom MCPs quickly to help meet demanding design schedules.
Stay competitive in the mobile device market
SamsungMCPs help you stay ahead of the competition in the fast-moving mobile device market. With minimized power consumption, small size, and high memory density, SamsungMCP solutions offer the memory foundation to build a full spectrum of high-end consumer electronic devices. Use Samsunghigh-density MCPs to capitalize on the growing trend for powerful multimedia applications and wireless Internet support that today's consumers expect from their portable devices.
See our catalog for full listings.
Manufacturer Part Number: |
K4B1G1646E-HCF7(SamsungSemiconductor)Original |
Manufacturer / Brand: | Original Brand |
Quantity Available: | 45100(contact us to confirm the available quantity) |
Unit Price: | Contact us |
D/C (Date Code): | Generally newest 2014+ |
Lead Time (Delivery Time): | IN STOCK, Fast delivery |
Condition: | NEW AND UNUSED, ORIGINAL FACTORY PACKING |
Package / Case: | original |
Packaging: | Factory sealed packing |
SPQ (Standard Package Quantity): | Contact us |
MOQ: | 20Piece |
Datasheet Download: | Contact us Contact: winwin-ke@hotmail TradeManager:winchips /skype:win-chips |
Factory sealed packing,and sended in the following types: Tube, Tray, Tape and Reel, Bulk packing, Bag, etc. Please kindly confirm with your sales if you need any other assistant or demand.
Delivery time:
The goods will be shipped within 1-2 working days after confirming buyer’s payment. If you are in urgent need, we will arrange the shipment on the very day.
Shipment:
1.If you don’t have a account with any courier, we will arrange shippment and prepay the shipping cost here.
2.The item you order will be sent by DHL, UPS, FedEX, TNT and etc. If you prefer any other shipping ways, please tell us and we will check whether it is available. We will ensure the lowest shipment cost.
- if your address is remote area , you need to pay the extra charge of DHL $USD35,other wise we will send the package by EMS.Hope your kindness understanding .Thanks!
- for the customs value , if you have special requirements ,pls let us know . otherwise we will do it as our regulation (usually $USD10-20)
Tracking:
When our colleague sell your parts out. The tracking number will be e-mail to you immediately. Please confirm the receipt of the products if you receive the parcel.
Quality Control:
Before each shippment, our every product must be examined. If it fail to pass our internal inspection, we will inform you at the right time.
Refund&Replacement:
If some of the items you received aren’t in exact conform with your requirs. We would still responsibly arrange your refund and replacement. The return items must remain their original condition as same as what we sent to you.
- Pls contact us within warranty period(1 months ). Warranty doesn’t include any man-made damage
Others:
Any other request, please feel free to contact with our salesman.
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Contact Us
- Shenzhen Pcxy Technology Co., Limited
- Contact nameLily ke
- Phone86-0754-13714045673
- AddressI Room,18/F,D Building,Huaqiang plaza,Huaqiang North Road,Futian District,Shenzhen Shenzhen,Guangdong
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