BGA Rework System

Specifications

1. The movable heating head is easy to operate; hot air head and mounting head are manuallycontrolled; PCB sliding rack is micro-adjustable with X and Y axes;

2. Color optical system with functions such as spilt vision, zoom-in and micro-adjust, auto-
focus and menu operation, equipped with aberration detection device;

3. Color LCD monitor;

4. Touch screen interface,PLC control, with password and data protection function while
power on;can display multiple profiles at any time; temperature precisely controlled within 2°C.

5. Three heaters heating independently, both upper and lower heater can control multi stageson the profile simultaneously, large bottom IR heating area to heat PCB evenly; temperature,time, rate, cooling and alarm events are all displayed on the touch screen;

6. Over-heating protection for the hot air heating head; temperature of hot air in the upper andinfrared at the bottom is program controllable;

7. 6 segmentsconstant temperature control, profile saving is unlimited in the industrial computer;
profile analysiscan be carried out on the touch screen; with computer communication functionas
computers,with communication software attached; with temperature measurement function;

8. The supports for the BGA soldering supporting frame are micro-adjustable to restrain
localsinkage in the soldering area;

9. Built-in vacuum pump;60 rotating in φ angle mounting nozzle is micro-adjustable.

10. Large IR pre-heating from the bottom, made of imported high quality heater, will heat thePCBevenly
to avoid deformation and keep solder effect; heating board is independently
controlled;