BGA Rework System

BGA Rework System photo-1
US$ 700 - 850 MOQ: 1 Set
Key Specifications
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Place of Origin:
Guangdong, China
Brand Name:
Gosmt
Model Number:
GP1212
Payment & Shipping
Payment Methods:
Port of Shipment:
Shenzhen
Delivery Detail:
Delivery time depends on order quantity.
Place of Origin Guangdong, China
Brand Name Gosmt
Model Number GP1212

Specifications

1.BGA Rework System
2.Support computer control
3.Lead free rework
4.German infrared heater
5.durable

BGA Rework Station

 

Parameter

 

Basic Parameters
Heating German infrared heater
Dimension L480mm*W485mm*H420 mm
Weight 15.3kg
Total weight About 17 kg, vary with the different need of the users
Electrical Parameters
Power 220V AC
Upper Heating German infrared heater
Size of Upper heating 80mm*80 mm
Consumption of upper heating 400W
Bottom Heating German infrared heater
Size of Bottom heating 185 mm*185 mm
Consumption of Bottom heating 1000W
General power 1450W
Temperature Control
Control mode of Upper Independent temperature control, high-precision closed-loop control, precision ± 0.5%, Alarm, USB linked computer systems, curve control
Control mode of Bottom Independent temperature control, high-precision closed-loop control, precision± 0.5%, Alarm, USB
Rework Function
SMD Suit for welding, remove or repair packaged devices such as BGA, PBGA, CSP, multi-layer substrates, EMI metallic shield product and solder/lead free Rewor, kwelding
Size of applicable chips ≤70mm*70 mm
Size of applicable PCB ≤400mm*305 mm

 

 

Main Components:

BGA Rework System

BGA Rework System

1. Upper Heater (German infrared heater)

2. Highly Sensitive K-temperature sensor

3. PCB Table

4. Power Switch

5. Bottom Temperature Control

6. Cooling Switch

7. Lighting Switch

8. Stop Switch

9. Start Switch

10. Upper Programmable Temperature Control (USB connection notebook computer, for curve control)

11.Bottom Heater (German infrared heater 900W)

12. LED lamp (imported LED lamp, long service life, the luminosity high)

13.X-Y Lifting Regulator

14. Upper FAN

15. Bottom FAN

16. Above section connection mouth (The Upper heating, fan )

17. Temperature probe connection mouth (Upper)

18. 220V power

19. Connect computers serial interface

 

Rework Operation Steps

 

1. Preparation

 

1) Fix motherboard

BGA Rework System

 

2)  shift sensor , close to BGA chip.

 

BGA Rework System

 

3) Adjust the height of heating head with adjustment knob

(BGA chip in the middle of heating head, heating head away from BGA chip ≥ 2cm)

BGA Rework System

 

2. Start heating

 

1)Open power switch.

2)Select the appropriate temperature program segment, and then press the start switch.

Can press the stop switch to stop operation .

 

BGA Rework System

 

 

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Business Type
Trading Company
Year Established
2012
Factory Size
Below 1,000 square meters
Total Employees
11 - 50 People

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