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Specifications
1.for BGA Rework operation2.independent temperature control
3.upper heating 80x80mm
4.bottom heating 180x180mm
5.IR heating
BGA Rework Station
| Heating | IR |
| Dimension | L 475mm*W480mm*H420 mm |
| Weight | 15kg |
| Total weight | About 17 kg, vary with the differen need of the users |
| Electrical Parameters | |
| Power | 220VAC |
| Upper Heating | IR |
| Size of Upper heating | 80mm*80 mm |
| Consumption of upper heating | 450W |
| Bottom Heating | IR |
| Size of Bottom heating | 180 mm*180 mm |
| Consumption of Bottom heating | 800W |
| General power | 1250W |
| Temperature Control | |
| Control mode of Upper | Independent temperature control, high-precision closed-loop control, precision ± 0.5%, Alarm |
| Control mode of Bottom | Independent temperature control, high-precision closed-loop control, precision ± 0.5%, NO Alarm |
| Rework Function | |
| SMD | Suit for welding, remove or repair packaged devices such as BGA, PBGA, CSP, multi-layer substrates, EMI metallic shield product and solder/lead free Rework, welding |
| Size of applicable chips | ≤70mm*70 mm |
| Size of applicable PCB | ≤400mm*305 mm |
| Others | |
| Power | 1250W |
| Voltage | 220V 50 / 60 HZ |
| Weight | Appox 18KGs |
| Size | 475 mm*480 mm*420 mm |
Composition
1. High Sensititve K-temperature sensor
2. PCB Table
3. Power Switch
4. Upper heater
5. X-Y Lifting Regulator
6. LED Auxiliary Lighting
7. Bottom Heater (Pre-heater)
8. Lighting Switch
9. Upper Fan Switch
10. Start Switch
11. Stop Switch
12. Upper Programmable Temperature Control
13. Bottom Temperature Control
Rework Operation Steps
1. Preparation
1) Fix motherboard
2) shift sensor, close to BGA chip
3) Adjust the height of heating head with adjustment knob ( BGA chip in the middle of heating head, minimum distance between heating head and BGA chip should be 2cm)
2. start heating
1) open power switch
2) Select appropriate temperature program segment, and then press the start switch. Can press the stop switch to stop operation.
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