BGA Rework Station

Specifications

1.for BGA Rework operation
2.independent temperature control
3.upper heating 80x80mm
4.bottom heating 180x180mm
5.IR heating

BGA Rework Station

 

Heating	IR
Dimension	L 475mm*W480mm*H420 mm
Weight	15kg
Total weight	About 17 kg, vary with the differen need of the users
Electrical Parameters
Power	220VAC
Upper Heating	IR
Size of Upper heating	80mm*80 mm
Consumption of upper heating	450W
Bottom Heating	IR
Size of Bottom heating	180 mm*180 mm
Consumption of Bottom heating	800W
General power	1250W
Temperature Control
Control mode of Upper	Independent temperature control, high-precision closed-loop control, precision ± 0.5%, Alarm
Control mode of Bottom	Independent temperature control, high-precision closed-loop control, precision ± 0.5%, NO Alarm
Rework Function
SMD	Suit for welding, remove or repair packaged devices such as BGA, PBGA, CSP, multi-layer substrates, EMI metallic shield product and solder/lead free Rework, welding
Size of applicable chips	≤70mm*70 mm
Size of applicable PCB	≤400mm*305 mm
Others
Power	1250W
Voltage	220V 50 / 60 HZ
Weight	Appox 18KGs
Size	475 mm*480 mm*420 mm

 

Composition

 

 

1. High Sensititve K-temperature sensor

2. PCB Table

3. Power Switch

4. Upper heater

5. X-Y Lifting Regulator

6. LED Auxiliary Lighting

7. Bottom Heater (Pre-heater)

8. Lighting Switch

9. Upper Fan Switch

10. Start Switch

11. Stop Switch

12. Upper Programmable Temperature Control

13. Bottom Temperature Control

 

Rework Operation Steps

 

1. Preparation

 

1) Fix motherboard

2) shift sensor, close to BGA chip

 

3) Adjust the height of heating head with adjustment knob ( BGA chip in the middle of heating head, minimum distance between heating head and BGA chip should be 2cm)

 

2. start heating

 

1) open power switch

2) Select appropriate temperature program segment, and then press the start switch. Can press the stop switch to stop operation.