BGA Rework Station
Specifications
1.for BGA Rework operation2.bottom heating 360x200mm
3.have infrared glass
4.Upper heating 80x80mm
5.weight 18kg
BGA Rework Station
Parameters
| Heating | infrared heater | |
| Dimension | L 480mm×W485mm×H420 mm | |
| Weight | 16.5kg | |
| Total weight | ≈18 kg, vary with the different need of the users | |
| Electrical Parameters | ||
| Power | 220V AC | |
| Upper Heating | imported infrared heater | |
| Size of Upper heating | 80mm×80 mm | |
| Consumption of upper heating | ≈450W | |
| Bottom Heating | imported infrared heater | |
| Size of Bottom heating | 200 mm×360 mm | |
| Consumption of Bottom heating | ≈1600W | |
| General power | 2100W | |
| Temperature Control | ||
| Control mode of Upper | Independent temperature control, high-precision closed-loop control, precision ± 0.5%, Alarm,USB linked computer systems, curve control | |
| Control mode of Bottom | Independent temperature control, high-precision closed-loop control, precision ± 0.5%, NO Alarm,USB | |
| Rework Function | ||
| SMD | Suit for welding, remove or repair packaged devices such as BGA,PBGA,CSP,multi-layer substrates,EMI metallic shield product and solder/lead free Rework ,welding | |
| Size of applicable chips | ≤70mm×70 mm | |
| Size of applicable PCB | ≤420mm×330 mm | |
Composition
1.Upper FAN
2.X-Y Lifting Regulator
3.LED Lamp
4.PCB Table
5.Upper Heater
6.Bottom Heater (Infrared glass, temperature sensor)
7.Upper programmable Temperature Control
8.Bottom Temperature Control
9.Lighting Switch
10.Bottom Cooling Switch
11.Start Switch
12.Stop Switch
13.Top Fan Switch
14.Highly Sensitive K-temperature sensor (Upper)
15.Temperature sensor interface
16.220V-power
17.Power Switch
18.Above section connection mouth(the upper heating ,fan)
19.Connect computers serial interface (support USB connection, using a laptop computer)
20.Bottom fan.
Rework Operation Steps
1. Preparation
1) Fix motherboard
2) shift sensor, close to BGA chip
3) Adjust the height of heating head with adjustment knob ( BGA chip in the middle of heating head, minimum distance between heating head and BGA chip should be 2cm)
2. start heating
1) open power switch
2) Select appropriate temperature program segment, and then press the start switch. Can press the stop switch to stop operation.
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