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Specifications
1. Color optical system2. Touch screen interface
3. Color LCD Monitor
4.Built-in vacuum pump
5.Large IR area heater
Features:
1. Hot air head and mounting head are designed 2 in 1, and have both the auto soldering and mounting function;
can store 200 groups of different BGA heating points and register marks;
2. Color optical system with functions of split vision, zoom - in and micro-adjustment,equipped with aberration de
-tection device; with auto focus and software operation function,27X optical focus;can rework BGA dimension up
to 70mm×70mm;
3. Touch screen interface, PLC control; real-time profie display,able to display temperature curves and detecting cu
-rves at the same time;
4. Color LCD monitor;
5. Built-in vacuum pump, 60° rotation in Φ angle; mounting nozzle is micro-adjustable;
6. 8 segments of temperature up (down) and 8 segments constant temperature control, 200 groups of temperature
curve are stored; Curve analysis can be carried out on the touch screen;
7. Able to arrive at three independent temperature zones,temperature and time can be displayed digitally on the touch
screen;able to rework CGA;
8. The supports rack can be adjusted to restrain the local sinkage of the BGA soldering area;
9. Suction nozzle can identify material and mounting height automatically, and can control the gas pressure within a
small range of 30g-50g;
10. Heaters can be moved ina any location within the working area to fit for reworking BGA in different positions on PCB
11. Finished the BGA rework process under the nitrogen save through remain the nitrogen joggle in advance,have spec- ail function for save nitrogen to saving cost;
12. Have the fuction for over-heating protection;
13. Large IR area heater from the botton will heat the PCB evenly to avoid deformation and keep soldering effect, heating
borad is independent controlled;
14. Epuipped with different alloy hot gasnozzles, easy to replace and able to locate in any angle;
15. The integrative heating head, driven by step motor; can store 200 groups of different heating points and register marks.
Specification:
| PCB Dimension | W20*D20 - W450*W400mm |
| PCB Thickness | 0.5 - 4mm |
| Applicable chip size | 1 x 1 - 70 x 70mm |
| Placement precision | ±0.02mm |
| PCB Locating way | outer or jig |
| Working table adjustment | ±10mm forward/backward, ±10mm left/right |
| Temperature control | K-type thermocouple, closed cycle controlled |
| Preheater | far infrared 3000W |
| Top heater | hot air, 1000W |
| Power supply | single-phase 220V, 50/60Hz 6KW |
| Air supply | 5-8kgf/cm2, 60L/min |
| Machine Dimension | L700 x W660 x H950 |
| Max BGA Weight | 300g |
| Weight | 120kg |
More pictures on BGA Rework Station
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