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China Chaosheng Electronics Multi domain high-end circuit board technical specifications and process specifications
Applicable industries:
* * automotive electronics, medical, industrial control, military aerospace, ion equipment, servers, 5G communication, radar, drones, robots, wireless terminals, automation equipment**
>Overall divided into: board selection, surface treatment, key processes, reliability standards, and industry-specific requirements
1、 General requirements for general basic technologies (applicable to high-end industrial boards)
1. Selection of substrate sheet materials
|Application direction | Recommended board | Characteristic description|
|Conventional industrial/intelligent hardware/wireless terminal | FR-4 TG170/TG180 | Temperature resistance Tg ≥ 170 ℃, high heat resistance, low Z-axis expansion, lead-free reflow soldering 260 ℃|
|Server, 5G, high-speed signal board | Low loss board: Isola, Rogers, Shengyi high-speed material S7038, TU-872 | DK/Df controllable, impedance accurate, meets PCIe, DDR, high-speed differential signal|
|RF, radar, high-frequency antenna, 5G millimeter wave | PTFE/ceramic filled high-frequency board, RO4350B, RO5880 | extremely low dielectric loss, low high-frequency signal attenuation|
|Military, aerospace, high vibration working conditions | High reliability FR-4 Class3, polyimide PI board | Wide temperature range, radiation resistance, high mechanical strength, and extreme environmental resistance|
|High power, industrial control power supply, power control board | Thick copper plate, aluminum/copper based MCPCB | Copper thickness 2oz-10oz, good heat dissipation, carrying high current|
>Thickness range: 0.4mm to 3.2mm; Layers: 2 to 32 or more layers;
Copper thickness: signal layer 0.5oz -2oz; Power supply layer 2-12oz thick copper
2. Surface treatment process (selected by scenario)
1. * * Selective electroplating of hard gold (thick gold fingers)**
Nickel 3-6 μ m+hard gold Au 0.8-2.5 μ m, gold cobalt alloy
Applicable: Board edge connectors, plug-in modules, servers, industrial control expansion boards
> ⚠️ Plugging and unplugging contacts * * cannot use ordinary gold-plated ENIG * *, insufficient wear resistance
2. Chemical immersion gold ENIG**
Nickel 2-4 μ m+Gold 0.05~0.15 μ m
Applicable: BGA, QFN precision solder pads, medical, automotive, industrial control surface mount boards (no plug and play)
3. Silver/tin deposition**
Suitable for large-scale SMT, low-cost high-end industrial boards, pay attention to moisture-proof storage
4. OSP organic solder mask**
Ordinary signal boards and consumer smart hardware are not suitable for long-term storage
5. * * Thick Gold+Localized Palladium Plating (ENEPIG)**
Military, aerospace, radar, 5G RF modules, long-term oxidation resistance, multiple reflow soldering
3. Core process capability
-Minimum line width and spacing: * * 3mil/3mil (0.075mm) * *, BGA fine wire
-Minimum aperture: mechanical drill 0.15mm; laser blind hole 0.075mm (HDI blind buried hole structure)
-Impedance control: single ended 50 Ω, differential 90 Ω/100 Ω, tolerance ± 5%, ± 10% (high-speed board ± 3%)
-Solder mask: liquid photosensitive green oil/black oil/matte black, high temperature resistance, anti reflection (commonly used matte black solder mask in radar and military industry)
-Golden finger chamfer: 30 °/45 ° beveled edge, locally thickened gold plating
-Laminated tolerance, hole accuracy, and strict control of expansion and contraction
-Impedance, withstand voltage, insulation resistance, withstand voltage, salt spray, temperature cycling reliability testing
4. General Reliability Standards
-Civil Industry: IPC-6012 Class 2
-Military/aerospace, high reliability equipment: IPC-6012 Class3
-Automotive Electronics: IATF16949, AEC-Q100
-Medical equipment: ISO-13485, biocompatible, low ion precipitation
-5G Communication: IPC-4101 High Frequency Substrate Specification
2、 Special technical specifications for circuit boards in various segmented industries
1. Automotive electronic PCB
Products: BMS battery management, in car central control, ADAS autonomous driving, headlights, body control, in car communication board
-Substrate: High TG FR-4, CAF ion migration resistant board
-Working temperature: -40 ℃~+125 ℃
-Process: Thick copper power lines HDI、 High insulation and voltage resistance, vibration resistance
-Surface treatment: immersion gold ENIG/ENEPIG; Connector contact hard gold finger
-Mandatory standard: IATF16949, PPAP file package available
2. Medical electronic circuit board
Equipment: monitor, testing instrument, surgical equipment, imaging equipment, portable medical terminal
-Low ion precipitation and low halogen optional, reducing corrosion
-High precision BGA, fine wiring, high insulation
-Surface priority gold deposition ENIG, high reliability of solder joints
-Moisture proof, disinfectant resistant environment, stable temperature circulation
-Compliance: ISO13485
3. Industrial control/Industrial computer/Industrial power control/Automation
PLC、 Motion control, frequency converter, industrial control motherboard, IO board
-Wide temperature range -40~85 ℃, anti-interference, dust and moisture resistance
-Multilayer board, thick copper in some high-power areas
-The card insertion module uses * * thick hard gold fingers * * 1.27-2 μ m
-High voltage resistance, anti electromagnetic interference, long life uninterrupted operation
4. Server PCB
Computing power motherboard, memory board, accelerator card, backplane, PCIe 5.0 board
-High speed and low loss board with strict differential impedance of 100 Ω
-Number of high-rise buildings, large-sized boards HDI、 Back Drill technology reduces signal residue
-DIMM/PCIe gold fingers: hard gold 1.27-1.5 μ m, 45 ° chamfer
-High heat dissipation design, thick copper foil for high current
5. 5G communication, wireless terminals, wireless appliances
Base station unit, gateway, router, wireless module
Divided into 2 categories:
1. Digital control board: high-speed FR-4, HDI, precision BGA
2. RF board: Rogers high-frequency board, strict impedance 50 Ω single ended
Surface: Immersion gold, localized gold plating, low loss, reduced signal attenuation
6. Radar and jammer
High frequency RF circuit board, microwave board
-PTFE/ceramic high-frequency material with extremely low Df loss
-High precision impedance, flat copper surface, low roughness copper foil
-Matte black solder mask reduces reflection, locally thick gold-plated contacts
-Wide temperature range, high vibration resistance, and sealing compatibility
7. Drone&Robot Circuit Board
Flight control board, power drive, sensor board
-Lightweight, optional thin substrate 0.6-1.2mm
-High density HDI, miniaturization
-Anti vibration, impact, wide temperature operation
-Local thick copper heat dissipation in the power drive area
8. Ionic equipment/industrial high-power equipment
Plasma, ion cleaning, high-voltage power board
-High voltage insulation, increased wire spacing, anti creepage measures
-Thick copper circuit, aluminum/copper substrate heat dissipation
-Arc resistant and high voltage resistant design
9. Military, aerospace PCB
-IPC-6012 Class3 highest reliability level
-PI polyimide or special high-temperature resistant substrate
-ENEPIG palladium or selective thick hard gold
-Anti radiation, ultra wide temperature range -55 ℃~+125 ℃
-Strict full process traceability, full testing, non-destructive testing
3、 Chinese and English foreign trade keywords (can be directly listed, quoted, etc.)
Automotive electronic circuit board, medical equipment PCB, industrial control board, military aerospace circuit board, ion equipment high-voltage board, server high-speed PCB, 5G communication circuit board, radar RF microwave board, wireless terminal motherboard, industrial computer motherboard, industrial power control thick copper plate, automation control board, drone flight control board, robot control board, high-frequency low loss circuit board, thick metal finger industrial board, HDI blind buried hole circuit board
English Keywords
Automotive electronics PCB, Medical equipment circuit board, Industrial control PCB, Aerospace & military grade PCB, Ion‑equipment high‑voltage board, High‑speed server PCB, 5G communication circuit board, Radar RF microwave PCB, Wireless terminal motherboard, Industrial SBC mainboard, High‑power industrial control PCB, Automation controller board, Drone flight‑control PCB, Robot control board, High frequency low loss PCB, Thick hard gold finger circuit board, HDI blind & buried via PCB
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