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Contact: Mank. Li
China Chaosheng Electronic Thermoelectric Separation Double Multilayer and Embedded Copper Based Circuit Board PCB
Single and double-sided PCB, high thermal conductivity thermoelectric separation PCB, high thermal conductivity multi-layer copper based PCB, high thermal conductivity multi-layer aluminum based PCB, multi-layer thick copper aluminum based PCB, metal based circuit board PCB, MCPCB, high thermal conductivity heat dissipation PCB, thermoelectric separation technology PCB, copper convex thermal conductivity PCB, embedded copper core PCB, low internal resistance heat dissipation PCB, electric thermal isolation PCB, high-density wiring PCB, thermal resistance optimization PCB, lightweight substrate PCB, high stability PCB, thermal interference resistance PCB, ultra-high power adaptation, integrated molding PCB, embedded copper based PCB, embedded copper core PCB, integrated heat dissipation substrate, ultra-thin precision copper substrate PCB, embedded thermal conductivity structure PCB, high integration heat dissipation board, uniform heat noise reduction PCB, high reliability precision circuit board PCB, thermoelectric separation aluminum Base PCB, aluminum based heat dissipation PCB, lightweight metal substrate PCB, cost-effective heat dissipation board PCB, local fast thermal conductivity, electric thermal isolation PCB Medium to high power aluminum substrate, thermoelectric separation copper base, copper convex heat dissipation, thermal resistance optimization PCB, electric thermal separation, window opening thermal conductivity PCB, ultra-high heat dissipation PCB, high-power copper substrate PCB, insulation free thermal conductivity, thermal interference resistance circuit PCB,
Core technical features
A single-layer circuit board is the simplest basic printed circuit board in structure, consisting of only one layer of conductive copper foil circuit layer, insulation substrate layer, and protective solder mask layer. All component soldering and circuit wiring are concentrated on one side of the substrate, while the other side is designed as a pure substrate without circuit. The production process is mature and simple, requiring only surface processes such as single etching, single exposure, and single gold/tin deposition. The production cycle is short, the yield is high, and the cost is low. The circuit layout is neat and the wiring is simple, suitable for conventional electronic circuits with low power, low integration, and simple structure. There are no complex processes such as interlayer conduction and via interconnection, and the electrical stability is strong with extremely low failure rate.
2、 Double layer circuit board (double-layer PCB)
Core technical features
The double-layer circuit board has two independent conductive copper foil circuit layers on top and bottom, separated by an insulating substrate in the middle. The upper and lower layers of the circuit can be connected through metalized vias, breaking through the short board of limited wiring space in single-layer boards. Compared to single panels, the wiring density is higher, the circuit design is more flexible, and complex circuit layouts can be achieved, balancing electrical performance and miniaturization requirements. The production process includes core processes such as double-sided exposure, double-sided etching, via metallization, and interlayer conductivity. It has excellent electrical insulation and conductivity stability, and is suitable for low to medium power and medium integration electronic devices. It is a mainstream basic circuit board type for civilian and industrial use.
3、 Conventional copper based circuit board (ordinary copper based MCPCB)
Copper based circuit board is a metal based heat dissipation circuit board made of high-purity electrolytic copper (purity ≥ 99.95%) as the substrate, combined with insulation dielectric layer and conductive copper foil layer. The thermal conductivity of copper substrate can reach 380-401W/(m · K), and the heat dissipation performance is 2-3 times that of ordinary aluminum substrate. The overall structure adopts a three-layer composite structure of "copper substrate+insulation layer+circuit layer". The heat of the components is conducted to the copper substrate through the insulation medium layer to achieve full area heat dissipation. It has the advantages of high thermal conductivity, good thermal stability, high mechanical strength, deformation resistance, corrosion resistance, and thermal expansion coefficient suitable for semiconductor devices. Conventional copper substrate electrical circuits share the same dielectric layer as the heat dissipation path, and the heat dissipation efficiency is limited by the thermal conductivity of the insulation layer. It is suitable for electronic scenes with medium to high power, high heat generation, and high stability requirements.
4、 Thermoelectric separation copper based circuit board
Core technical features
Thermoelectric separation copper based circuit board is an upgraded and iterated product of ordinary copper substrate, with the core technology of physical separation of electrical path and heat dissipation path. Through the process of opening windows in the insulation layer and forming copper protrusions, pure copper thermal conductive protrusions are reserved in the heating area of power devices. The protrusions are directly attached to the copper based substrate, bypassing the low thermal conductivity insulation layer, allowing the heat of the components to be quickly conducted to the substrate through the copper protrusions. The thermal resistance is reduced by more than 80% compared to conventional copper substrates, completely solving the heat dissipation bottleneck caused by insulation layer insulation. At the same time, the circuit signal wiring is independently distributed above the insulation layer, achieving a partitioned working mode of "circuit power transmission and convex heat transfer", eliminating the interference of high temperature on the signal circuit, and can be adapted to 50-500W+ultra-high power scenarios, effectively reducing light attenuation and device loss, and greatly extending the service life of equipment.
5、 Thermoelectric separation aluminum based circuit board
Core technical features
The thermoelectric separation aluminum based circuit board is based on the upgraded aluminum based MCPCB, using aluminum substrate as the heat dissipation base, combined with thermoelectric separation protrusion structure design, balancing the advantages of lightweight and efficient heat dissipation. Following the core principle of "electric heating zoning", the heating area is directly connected to the aluminum substrate through dedicated aluminum/copper thermal conductive protrusions, avoiding the heat dissipation resistance of the insulation layer and greatly improving local heat dissipation efficiency. At the same time, the signal circuit is independently wired to isolate thermal interference. Compared to copper substrates for thermoelectric separation, aluminum based sheets are lighter in weight, lower in cost, and have better processability, making them suitable for medium to high power, weight sensitive, and cost-effective scenarios; The short board has slightly lower thermal conductivity and mechanical strength than copper based materials, making it unsuitable for ultra-high temperature and ultra-high heat flux conditions.
6、 Embedded copper based circuit board
Embedded copper based circuit board is a high-end precision metal substrate process, with the core technology being copper based embedded molding process. Through precision processes such as slotting, copper sinking, filling, and pressing, high thermal conductivity copper blocks, copper pillars, or copper based heat dissipation structures are embedded into the substrate of the circuit board, rather than traditional surface bonding structures. This design realizes the integration of heat dissipation structure and circuit board, with higher substrate flatness, extremely strong structural stability, no protruding structure, and is suitable for ultra-thin, miniaturized, and highly integrated devices. Embedded copper cores can conduct heat uniformly throughout the entire area, eliminate local hotspots, and have better heat dissipation uniformity than traditional copper substrates. At the same time, they have the characteristics of anti vibration, anti deformation, high temperature resistance, high insulation and anti puncture, which can be adapted to harsh scenarios such as precision industrial control, new energy, high-end lighting, and high-frequency power devices.
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