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Help CenterMiJing Z23 Precision Tin Planting Mold for Samsung Galaxy Series
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MiJing Z23 Tin Planting Station for advanced Samsung hardware maintenance. This tool provides a stable, high-adhesion environment for BGA reballing, allowing technicians to perform precise tin planting on delicate mid-frame components with minimal risk of solder bridging or misalignment.
Features:
1. Designed using OEM-grade data to ensure the stencil apertures precisely match the solder pads on Samsung series motherboards.
2. Equipped with a high-precision 0.12mm (T) stencil for stable and uniform solder ball application.
3. Magnetic base design allows for quick and secure positioning module attachment, improving operational stability and repair efficiency.
4. Supports Samsung S20–S25 series flagship models, covering Ultra, Plus, and standard versions.
5. Modular design enables rapid swapping of positioning modules to accommodate different motherboard models.
6. Precision alignment structure minimizes manual adjustment errors and increases the success rate of mid-layer reballing.
7. Lightweight metal construction ensures portability and suitability for long-term repair use.
Options:
1. Universal Magnetic Base.
2. Positional mold with BGA stencil.
Supported Models:
Compatible with Samsung Galaxy Series: Samsung Galaxy S25 Ultra/S25+/S25/S24 Ultra/S24+/S24/S23 Ultra/S23+/S23/S22 Ultra/S22+/S22/S21 Ultra/S21+/S21/S20 Ultra/S20+/S20. Will support more models in the future.
Product Specifications:
Reballing Platform Specifications
Brand: MIJING
Product Name: Samsung Middle-Layer Reballing Platform
Model: Z23
Stencil Thickness: 0.12mm
Packaging: 1 pc/box
Platform Dimensions: 96x90.2x10.2 mm
Module Dimensions: ≈80mm / 75mm
Weight: ≈58g (slight variations in individual module weight possible)
Material: Precision-machined metal structure
Positioning Method: Magnetic positioning
Magnetic Base Specifications
Product Name: Samsung Middle-Layer Reballing Platform Base
Compatibility: MIJING Z23 / Z20MAX positioning modules
Dimensions: 130 x 103 x 18 mm
Weight: ≈195g
Function: Secures the positioning module; enhances reballing stability
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