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Help Center2UUL BH12 BGA Reballing Base With Curved Silicone Pad for Chip Repair
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2UUL BH12 Magnetic Reballing Platform for hardware repair. Equipped with a specialized curved silicone pad, it provides a stable interface for chip welding, PCB reballing, and IC component maintenance across mobile and computing devices.
Features:
1. Strong Magnetic Force: Extensive magnetic force ensures a firm fit between the stencil and the platform, improving operational stability.
2. Curved Surface Design: Precise curved surface design ensures a seamless fit with the stencil, guaranteeing accurate chip placement.
3. High Temperature Resistance: High-temperature resistant materials allow it to withstand the high-temperature environment during welding, ensuring long-term stable operation.
4. Wide Compatibility: Suitable for 2UUL series and universally compatible stencils, such as Phone17 T0.12, HI36A0 Hisilicon Kirin 9000S T0.12, etc.
Product Parameters:
Name: BH12 THE ONE PLATE Magnetic Curved Reballing Platform with Silicone Pad
Net Weight: 155g
Gross Weight: 161g
Package Size: 64mm×85mm×15mm
Product Size: 62mm×82mm×11mm
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