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Help Center2UUL PH11 Motherboard Pre-heating Station for Logic Board Delamination
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2UUL PH11 Motherboard Pre-heating Station for iPhone and Android logic board repair. Designed for layer separation and bonding, this hot-block provides constant thermal output to facilitate the disassembly of sandwich-structure motherboards.
Features:
1. Heat-resistant design: Effectively prevents accidental burns, ensuring safer use.
2. Movable clips: Flexible operation, easy adjustment and relocation.
3. Rapid heating: Quickly reaches the required temperature, improving work efficiency.
4. Precise temperature control: Temperature range from 40℃ to 245℃ ensures precise heating control.
5. High-temperature adaptability: Capable of handling equipment repair work requiring high temperatures.
Product Specifications:
Name: HOT BLOCK Pre-Heater
Code: PH11
Net Weight: 465g
Gross Weight: 0.6kg
Product Dimensions: 105x122x32mm
Packaging Dimensions: 245x173x52mm
Power: 240W
Voltage Options: 110V / 220V
Maximum Temperature: 245℃
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