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If you have any needs, please feel free to contact China Chaosheng Electronics Company. Please contact us as follows:
whatsapp：+8613528819118
Skype live: pcb-fpcb88@163.com
E-mail : sales@chaoshengpcb-fpc.com
Contact: Mank. Li
The production process of PCB+PCBA for AI drone driving by China Chaosheng Electronics is centered around
* * high-density, high-speed signal, high reliability, strong heat dissipation, and anti vibration
* *, and integrates AI assisted design and intelligent detection to meet the needs of autonomous driving, real-time perception, and high dynamic flight. The following will be discussed from four dimensions: PCB design and manufacturing, PCBA assembly, AI empowerment, and quality and reliability.
1、 Core Design and Manufacturing Process of PCB for China Chaosheng Electronics AI Drone
1. Core design points (adapted to AI autonomous driving) -Multi layer board and HDI high-density interconnection** Flight control/AI computing boards commonly use 6-12 layers, while industrial grade boards can reach up to 16 layers; Adopting blind/buried holes and step holes to shorten signal paths and increase wiring density, meeting the high pin count breakout requirements of AI chips such as NPU and FPGA. -High speed signal and impedance control** -Differential pair (SPI, CAN, LVDS, MIPI)
* * equal length, equidistant, ground wrapped
* *, impedance control * * ± 5% -8%
* * (single ended 50 Ω, differential 90-100 Ω). -High frequency RF (GPS, image transmission, data transmission) uses low loss materials such as Rogers, PTFE, and hydrocarbons, mixed with FR-4. -Power supply and high current design** -The ESC/PDB adopts
* * 2-5oz thick copper
* *, carrying * * 50-200A
* * high current to avoid heating and melting. -Power/ground plane division, digital/analog ground
* * single point grounding
* *, suppresses common mode interference. -Thermal management and vibration resistance
** -The main control, power supply, and electrical control areas are extensively covered with copper and a thermal via array to transfer heat to the bottom layer/shell. -High Tg (≥ 170 ℃), low CTE substrate, suitable for
* * -40 ℃~85 ℃ * * wide temperature and vibration environment. -AI Assisted Design (AIPR)
** AI tools such as Zuken AIPR automatically optimize layout and routing, reduce crosstalk, improve DFM compliance, and shorten design cycles.
2. Key processes in PCB manufacturing -
* * Substrate selection** -Consumer grade: * * FR-4 Tg ≥ 130 ℃
* *, cost-effectiveness priority. -Industrial/AI flight control:
* * High Tg FR-4 (Tg ≥ 170 ℃), low CTE, CAF
* * resistance, deformation resistance, and electrochemical migration resistance. -High frequency communication: Rogers/PTFE mixed pressure ensures RF performance.
* * Precision Process** -LDI laser direct imaging: The line width/spacing accuracy reaches 3mil (75 μ m), suitable for fine wiring. -Vacuum lamination+step lamination: Control interlayer expansion and contraction to avoid misalignment and impedance drift.
-* * Sinking copper+electroplating thick copper * *: The copper thickness on the hole wall is uniform, meeting the requirements of high current and reliability. -Surface treatment: ENIG (immersion gold) OSP、 Sinking tin
* *, balancing solderability and oxidation resistance.
2、 Core process of AI drone PCBA assembly
1. Process flow (SMT as the main method, mixed packaging as a supplement)
1. Document review and DFM inspection: Gerber, BOM, coordinates, assembly drawings, confirmation of special processes (thick copper, mixed voltage, impedance).
2. * * Material preparation
* *: AI chips IMU、GPS、LiDAR、 Electrically adjustable MOSFET, BGA/QFN/0201 micro components.
3. PCB baking board: Remove moisture and prevent welding delamination/board explosion.
4. SMT front-end** -Solder Paste Printing: Laser Steel Mesh (Thickness 0.1-0.15mm), SPI detects solder paste amount/offset.
-* * High precision SMT
* *: Mounting accuracy
* * ± 25-30 μ m
* *, supporting
* * 01005/0201
* * components and
* * 0.3mm pitch BGA
* *. -AOI in front of the furnace: detect missing, incorrect, and offset stickers.
5. Reflow soldering (core)
** -Multi temperature zone nitrogen reflux: oxygen content6. AOI+X-Ray at the back of the furnace: detecting empty welding, bridging, and virtual welding; X-Ray perspective of BGA solder ball bubbles/cracks.
7. DIP plugins and selective wave soldering: connectors, capacitors, and other plugins are locally soldered to avoid damaging SMT components.
8. * * Welding repair, cleaning, and three proof coating * *: Ultrasonic cleaning; Polyurethane/silicone coating, moisture-proof, dustproof, and salt spray resistant.
9. * * Testing and Aging
** -ICT/Flying Needle Testing: Verification of Circuit Connectivity and Component Parameters. -FCT Function Test: Simulate flight to verify AI algorithms, sensors, communication, and power control. -Aging+Environmental Stress Screening (ESS): 24-72 hours of power on, high and low temperature/vibration, screening out early failures.
2. Key assembly technologies -Double sided SMT: Two time printing/mounting/reflow, supported by low-temperature solder paste or fixtures on the bottom layer to prevent components from falling off. -BGA/CSP packaging process: ball placement/micro pitch mounting, nitrogen reflux, X-ray 100% inspection to ensure the reliability of AI core chips. -Anti vibration reinforcement: Glue is applied to the bottom of key components (IMU, main control), PCB is sealed/structurally reinforced to withstand flight vibration impact.
3、 Deep empowerment of AI technology in PCB+PCBA
1. AI assisted design (AIPR) -Intelligent layout: automatic partitioning, optimized component placement, shortened critical paths, and reduced EMI. -Intelligent cabling: differential pair automatic equal length, impedance matching, avoiding cross segmentation, and reducing via holes. -DFM/DFA intelligent inspection: early warning of solder pads, vias, line widths, and assembly conflicts.
2. AI intelligent production and testing -AI Visual Inspection: AOI/X-Ray uses deep learning to recognize small defects (such as BGA microbubbles and 0201 offset) with a detection rate of>99.5%. -Intelligent Process Parameter Optimization:
The AI model adjusts the reflow soldering temperature zone, solder paste printing pressure, and SMT speed in real-time to improve yield and consistency. -Production big data analysis: predicting equipment maintenance, optimizing yield, and tracing root causes of defects.
3. Collaboration between edge AI and PCB -The flight control board integrates
* * NPU/edge computing chips
* * to achieve real-time SLAM, target recognition, obstacle avoidance, path planning and reduce cloud dependence. -PCB design reserves
* * AI computing power expansion interfaces
* * (M.2, PCIe, FMC), supporting algorithm iteration and hardware upgrades.
4、 Quality Control and Reliability Standards -IPC standard: Control solder joints and appearance according to IPC-A-610 Level III (aviation/industrial grade). -
* * Reliability testing
** -Mechanical: vibration (10-2000Hz), impact, drop. -Environment: high and low temperature cycling (-40 ℃~85 ℃), humid and hot (85 ℃/85% RH), salt spray. -Electrical: high temperature aging, power supply deviation ESD、 Surge EMC/EMI。 -Traceability: Recording of materials, equipment, processes, and testing data throughout the entire process, supporting batch traceability
5、 Comparison of Typical AI Drone PCB+PCBA Solutions |Board type | Layer number | Substrate | Copper thickness | Key process | Application scenario| |AI flight control board | 8-12 layers | High Tg FR-4+Rogers hybrid | 1-2oz | HDI blind hole embedding, impedance control, BGA | Autonomous driving, real-time sensing| |Electric control board | 4-6 layers | High Tg FR-4 | 3-5 oz | Thick copper, high current, heat dissipation via | Motor drive, high current distribution| |Communication/image transmission board | 6-8 layers | Rogers/PTFE+FR-4 | 1oz | High frequency mixed voltage, impedance control, RF shielding | GPS, data transmission, high-definition image transmission|
6、 Core Challenges and Trends -
* * Challenge
* *: High density and heat dissipation balance, high-speed signal integrity, wide temperature/vibration reliability, AI chip packaging and soldering yield, cost control. -
* * Trend * *: 12-20 layer HDI+buried resistor buried capacitor
SiP/Chiplet integration
AI full process automation
environmentally friendly lead-free/halogen-free materials
flexible/rigid flex bonding board * * compatible with irregular body shapes. The combination of AI drone PCB and PCBA is a deep integration of hardware design, precision manufacturing, AI algorithms, and reliability engineering. It is necessary to consider performance, cost, and mass production from the design source in order to support the stable and safe flight of autonomous drones.
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