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Help CenterMECHANIC Sn63/Pb37 Soldering Tin Paste With Syringe and 3 Needles
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MECHANIC Syringe-Shape Solder Paste for mobile phone PCB soldering. Featuring a 10cc capacity and leaded Sn63/Pb37 composition, it facilitates the attachment of BGA components during motherboard repair.
Product Features :
High-quality performance : Good viscosity, uniform coating, good conductivity, oxidation resistance, no corrosion to PCB, no cleaning
Bright and full solder joints : Excellent wettability, fine and smooth paste, to ensure that there is no false welding and false soldering, and the solder joints are bright and full with less residue
Convenient packaging design : Simple syringe-type packing, equipped with a suitable needle tube, to ensure simple and convenient use, and no waste of welding, which can save repair cost
Function : Phone repair, manual patch, BGA chip tin planting, resistor-capacitor, LED patch, PCB BGA tin plating
Wide range of products : Mainly used for welding sensors, wires, motors, fuses, connectors, metal shells, lighting, electronic components, SMT maintenance, BGA chip ball planting, ect. of electronic components such as PCB surface resistance, capacitors and IC in the SMT industry.
Steps for usage :
Turn counterclockwise to open the cap.
Rotate clockwise and install the needle.
Open the bottom cover.
Install the putter then you can use it.
Note :
The white inner plug in the syringe cannot be removed.
The putter presented is just to facilitate the push of tin paste, not a supporting tool, it may be loose or tight, please place an order carefully if you mind.
Product name: Lead-free low temperature solder paste
Product Composition: S N42BI58
Product melting point: 138°C
Microns: 4#
Net Weight: 31.6g
Gross Weight: 40g
Product Size: 110mm*18mm
Storage temperature: 0-10℃
Scope of application: Paper board or other special welding that cannot withstand high temperature
Features: Full of solder joints, lead-free environmental protection, strong adhesion
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