Home > Industrial Equipment & Components > Compressor > Compressor Unit > SCAIR 30HP 1.0MPa Ultra-Pure Compressor for Wafer Fab Photolithography & Etch Tools

SCAIR 30HP 1.0MPa Ultra-Pure Compressor for Wafer Fab Photolithography & Etch Tools

SCAIR 30HP 1.0MPa Ultra-Pure Compressor for Wafer Fab Photolithography & Etch Tools photo-1
SCAIR 30HP 1.0MPa Ultra-Pure Compressor for Wafer Fab Photolithography & Etch Tools photo-2
SCAIR 30HP 1.0MPa Ultra-Pure Compressor for Wafer Fab Photolithography & Etch Tools photo-3
SCAIR 30HP 1.0MPa Ultra-Pure Compressor for Wafer Fab Photolithography & Etch Tools photo-4
SCAIR 30HP 1.0MPa Ultra-Pure Compressor for Wafer Fab Photolithography & Etch Tools photo-5
Negotiable MOQ: 1 Unit (Price negotiable depending on order volume and customization)
Key Specifications
Get Latest Price
Material:
Carbon Steel
Warranty:
one year
Drive Mode:
Electric
Payment & Shipping
Payment Methods:
Port of Shipment:
Dongguan
Delivery Detail:
7 days
Material Carbon Steel
Warranty one year
Drive Mode Electric
Lubrication Style Oil-less
Power Source AC Power
After-sales Service Maintenance
Performance Low Noise, Variable Frequency, Explosion-Proof
Principle Rotary Compressor
Mute Mute
Configuration Stationary
Transport Package wooden frame
Specification 10-100HP
Trademark SCAIR
Origin China


SCAIR 30HP 1.0MPa Ultra-Pure Compressor: Nanoscale Air Control for Advanced Node Fab

SCAIR’s 30HP compressor delivers 3.6 m³/min at 1.0MPa with SEMI F72 certification, preventing $380k/hour yield loss where airborne molecular contamination (AMC) causes stochastic defects in 2nm node EUV lithography.


AMC-Free Air Engineering for Sub-3nm Semiconductor Manufacturing

Featuring radical-assisted purification and mu-metal EMI shielding, this 22kW system achieves 95% mirror reflectivity in EUV scanners. Active vibration cancellation maintains 0.1μm/s vibration - essential for ±0.3nm overlay accuracy in High-NA lithography tools.


Fab Performance Specifications

  • Air Delivery: 3.6 m³/min @ 1.0MPa (3.2m³/min @ 1.2MPa for vacuum loadlocks)

  • Vibration Control: 0.1μm/s per ISO 10816-3 Class A

  • AMC Certification:

  • Particle Count: ISO Class 0 per ISO 8573-1:2010


Yield Protection Technologies

  • Molecular Scavenging: Photocatalytic oxidation destroys AMC at 0.01ppt detection limits

  • EMI Immunity: Mu-metal enclosure prevents >30dB magnetic interference

  • Pulse-Free Operation: Helical accumulators eliminate 0.15MPa ripple causing stage jitter

  • Cryogenic Compatibility: Maintains flow at -60°C for cryo-etch processes


Wafer Processing Applications

  • EUV Lithography: Supplies scanner stages preventing carbon deposition on $200M optics

  • Plasma Etch: Powers electrostatic chucks maintaining ±0.1°C temperature uniformity

  • Ion Implantation: Feeds wafer cooling systems with

  • Metrology: Drives AFM stages achieving 0.15nm measurement repeatability


SEMI Compliance Matrix

  • Certifications: SEMI S2/S8, SEMI F72 (AMC control), IEC 62443-3-3 cybersecurity

  • Material Safety: UL 94 V-0 flammability rating

  • Validation: NIST-traceable calibration per SEMI E89


Defect Reduction Q&A

  • Q: How to prevent stochastic defects in High-NA EUV?

    A:

  • Q: Solution for overlay errors during thermal cycling?

    A: ±0.05% pressure stability maintains stage flatness within 0.2nm during 10°C/min ramps.

  • Q: Reducing AMC in chemical filtration?

    A: Radical-assisted purification achieves 6-log AMC reduction at 0.01ppt detection limits.


Product Tags: 30hp semiconductor compressor , float glass production , weaving shed air

Send Inquiry to This Supplier

* Message
0/5000

Want the best price? Post an RFQ now!
Gold Verified Supplier
4Yrs
Verified Business License
Business Type
Trading Company
Year Established
2000
Annual Export Value
US$50 Million - US$100 Million
Port of Shipment
guangzhou, shenzhen, dongguan

Recommended Categories

Explore top categories and find suppliers for your specific needs