EVA Overview:
The main component of hot melt adhesive is a resin formed by copolymerization of ethylene and vinyl acetate under high pressure, which determines the basic properties of hot melt adhesive. In addition, viscosity enhancers (rosin), viscosity and solidification rate modifiers (paraffin), and a small amount of antioxidants (such as di tert butylbenzene) are used to improve the bonding strength and slow down the aging rate of hot melt adhesive. Hot melt adhesive is mainly used for wireless binding linkage lines of books and periodicals. After preheating the hot melt adhesive in the glue pot of the binding line, it is applied to the back of the book after milling and roughening.
The main characteristics of hot melt adhesive are:
1) There is no water or solvent in the small hot melt chamber. At room temperature, it is a solid, but at high temperatures, it becomes a liquid with good fluidity and is not flammable. Harmless to the human body;
2) The solidification speed is fast. After leaving the glue pot, it solidifies within 7-30 seconds without the need for drying or adding other curing agents, fully meeting the requirements of high-speed automation. Therefore, it has become the best adhesive material for the linkage line of flat wireless glue factories;
3) Hot melt adhesive can bond various substances, especially porous homogeneous materials with stronger bonding strength, and the cured adhesive film has good flexibility;
4) Hot melt adhesive can be reheated and reused, and it has strong chemical resistance.
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