SCAIR 100HP 1.2MPa Ultra-Pure Compressor for Semiconductor Fab Process Air & Vacuum Systems

SCAIR 100HP 1.2MPa Ultra-Pure Compressor: Atomic-Scale Air for Chip Fab Critical Processes

SCAIR’s 100HP compressor delivers 15.5 m³/min at 1.2MPa with SEMI F57 certification, preventing $2.8M/hour wafer losses where airborne molecular contamination (AMC) causes stochastic defects in 3nm node production.

Nanocontamination-Controlled Air Engineering for Silicon Manufacturing

Featuring molecular adsorption cascade technology, this 75kW system achieves <0.001ppt hydrocarbon levels critical for EUV optics protection. The active vibration cancellation maintains 0.1μm/s vibration - essential for <0.5nm overlay accuracy in ASML High-NA scanners.

Fab-Grade Performance Specifications

• Air Delivery: 15.5 m³/min @ 1.2MPa (13.8m³/min @ 1.5MPa for vacuum forelines)

• Purity Certification: ISO 8573-1 Class 0 (oil), Class 1 (particulates), Class 0 (moisture)

• AMC Control: <0.1ppt base amines (SEMI F72 compliant)

• Vibration Tolerance: 0.1μm/s per ISO 10816-3 Class A

Silicon Integrity Technologies

• Radical-Assisted Purification: Destroys AMC at 0.01ppt detection limits

• EMI Shielding: Mu-metal enclosure prevents >30dB magnetic interference

• Cryogenic Operation: Maintains flow at -40°C for cryo-etch processes

• Data Security: IEC 62443-3-3 certified controls with quantum-resistant encryption

Wafer Processing Applications

• EUV Lithography: Supplies scanner stages preventing carbon deposition on $150M optics

• Wafer Handling: Powers robotics with ISO Class 1 air for <0.1μm particle adders

• CVD Process: Feeds precursor delivery systems maintaining 0.001% gas ratio accuracy

• Etch Chambers: Maintains 10⁻⁷ mbar vacuum integrity during atomic layer etching

Semiconductor Compliance Matrix

• Certifications: SEMI S2/S8, ISO 14644 Class 1, TÜV SÜD AMC E20-069

• Material Safety: UL 94 V-0 flammability rating

• Traceability: SECS/GEM connectivity for fab-wide monitoring

Yield Management Q&A

• Q: How to prevent stochastic defects in High-NA EUV?

  A: Radical-assisted AMC destruction maintains <0.001ppt organics in scanner environment.

  
  

• Q: Solution for copper corrosion during CMP?

  A: -70°C PDP moisture control prevents galvanic corrosion at 1.2nm interconnect layers.

  
  

• Q: Vibration control for metrology tools?

  A: Hybrid active-passive isolation maintains <0.05nm vibration in CD-SEM systems.