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Help CenterSilver-copper 55 Alloy Powder Brazing Material Screen Printing
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AgCu28 is a eutectic alloy brazing material with a melting point of 779°C and good electrical conductivity, thermal conductivity, mobility and wettability. Not only has excellent process performance (suitable melting point, good wettability, caulking ability, etc.), and its thermal shock resistance, high welding quality, high sealing strength, can form a high-strength, highly conductive and corrosion-resistant brazing joints, can be welded to different kinds of metals and alloys, metals and metallized ceramics. Silver-copper alloy has higher hardness than pure silver, its electrical and thermal conductivity is better than other system alloys, and the price is lower than pure silver, which is widely used in the fields of electronic component manufacturing, surface coating, electrical engineering, welding materials, thermal management, and so on.
AgCu28 powder is suitable for brazing, additive manufacturing, laser cladding and other application processes, featuring controllable particle size, low oxygen content, low impurity content and batch stability.
1.Material standard
The composition meets the requirements of GB/T 18762-2017 specification for precious metals and their alloy brazing materials.
2.Controllable particle size
According to different application processes can be supplied in bulk: -500 mesh, -300 mesh, -200 mesh, 15-53μm, 45-105μm, 75-150μm and other particle size powder, can also be customized according to customer requirements.
3.Low oxygen content
The core oxygen content control technology can control the oxygen content of the powder according to the specific technical requirements of the application, the minimum can be controlled below 200ppm.
4.Low impurity content
The overall impurity content of powder can be controlled below 0.01% (except gas content), purity ≥ 4N9.
5.Microscopic morphology
The morphology of the powder is mainly spherical, which helps to ensure that the powder has good dispersion and fluidity.
6. Flowability
For 15-53μm powder for additive manufacturing, the Hall flowability is ≤15s/50g.
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