Pure Copper Powder

Copper (Cu) is a transition metal element, the element is purple-red, the density is 8.960g/cm³ (solid), the melting point is 1083.4 °C, the boiling point is 2562 °C, good ductility, good electrical and thermal conductivity, diamagnetic, is a common material for electrical and electronic components. High-purity low-oxygen copper powder is a pure copper powder with very high purity and very low impurity content, which is widely used in electronics, electrical, aerospace, powder metallurgy and chemical industries, and its unique physical and chemical properties make it ideal for manufacturing high-performance components and materials.

Our company uses 4N9 and 5N9 low-oxygen copper as raw materials, and adopts pure air atomization production process to produce, and the finished powder has good physical properties:

1. Ultra-high purity: The purity of gas atomized high-purity low-oxygen copper powder usually reaches 99.99%, 99.999% or higher. Its high purity makes it excellent in terms of electrical, thermal, and corrosion resistance, meeting the needs of high-precision and high-performance applications.

2. Low oxygen content: In the production process, the oxygen increment is strictly controlled, and the oxygen content of the finished powder product ≤ 200ppm, and the minimum can be controlled below 100ppm. This property avoids the formation of oxide layers, improves electrical and thermal conductivity, and improves the mechanical strength and ductility of the material.

3. High sphericity: the copper powder produced by gas atomization technology has uniform particle size, spherical or nearly spherical shape, and has good fluidity and filling. This fine, homogeneous particle provides a larger surface area for uniform distribution and product density in powder metallurgy and coating applications.

4. Good fluidity: the flow rate of powder hall is ≤20s/50g, and it has good fluidity.

5. Controllable particle size: pure copper powder with particle size of -500 mesh, 15-45 μm, 45-105 μm, 53-150 μm and other particle sizes can be prepared according to different application processes (other particle sizes can also be screened according to user requirements).