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Help CenterTwo-component Encapsulating System Based on Polyurethane.
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It is organosilicon potting adhesive is a class of two-part, room temperature curing, condensation dehydrogenation type organosilicon potting material, self-leveling, high and low-temperature resistance, with excellent aging resistance, flexibility, insulation, moisture, and shock resistance. Suitable for a variety of electronic components cast bonding, and sealing. Fully compliant with the EU ROHS directive requirements.
QLD584T Transparent Potting Compound
Suitable for potting and sealing of electronic components with transparent requirements.
QLD584P general-purpose potting compound
Suitable for potting and sealing of electronic components.
QLD584Z Thermally Conductive Flame Retardant Potting Adhesive
Suitable for various potting and sealing of electronic components with thermal conductivity and flame retardant requirements.
QLD584H High Thermal Conductivity Potting Adhesive
Suitable for potting and sealing electronic components with high thermal conductivity requirements.
QLD584ZF Thermally Conductive Flame Retardant Mouldproof Adhesive
Suitable for potting and sealing of electronic components with thermal conductivity, flame retardant and mould proof requirements.
Performance indicators
Performance indicators |
QLD584T |
QLD584P |
QLD584Z |
QLD584H |
QLD584ZF |
Appearance A/B |
Colourless and transparent |
White etc./Transparent |
White etc./Transparent |
off white etc./Transparent |
White,etc./ Transparent |
Density（g/mm3，A/B） |
0.95~1.05 |
1.3/1.03 |
1.3/1.03 |
1.3/1.03 |
1.3/1.03 |
Component A Viscosity（pa.s） |
1.5~2.5 |
5.5~11 |
7.5~13 |
7.5~13 |
7.5~13 |
Component B Viscosity（pa.s） |
0.01~0.1 |
0.01~0.1 |
0.01~0.1 |
0.01~0.1 |
0.01~0.1 |
Operable time (min) |
30~90 |
40~120 |
40~120 |
40~120 |
40~120 |
Full curing time (h) |
24 |
24 |
24 |
24 |
24 |
Hardness (shore A) |
10~30 |
20~40 |
20~50 |
20~50 |
20~50 |
Shearing strength（MPa） |
0.8 |
0.8 |
0.8 |
0.8 |
0.8 |
Thermal conductivity(W/M·K) |
0.3 |
0.3 |
0.7 |
2.0 |
0.7 |
Flame retardant grade（UL94） |
HB |
HB |
V0 |
HB |
V0 |
resistance to mould and mildew（Grade） |
/ |
/ |
/ |
/ |
0 |
Dielectric strength (kv/mm) |
≥18 |
||||
Volume resistance (Ω·cm，25℃) |
≥1.0×1014 |
||||
Applicable temperature (℃) |
-60~200 |
||||
Operation process
1. Before mixing, the A, B components in their respective containers fully stirred, shaking evenly.
2. Weigh A and B components according to the ratio, put them into the mixing tank and mix them well. It is best to vacuum defoaming for about 10 minutes, the amount of glue should not exceed 1/2 of the container, otherwise the glue will overflow when defoaming.
3. Pour the mixed adhesive into the product that needs to be sealed as soon as possible.
4. The potting workpiece is cured at room temperature, the surface is dry before entering the next process, and it takes 24 hours for complete curing.
Notes
1. If there is any precipitation or delamination of A component, it should be stirred well and used without affecting the performance of the product.
2. Mixed glue should be used up at one time, the unused glue and hardener should be sealed and stored.
3. Sealed storage in a cool and dry place for six months.
4. Packing specification: 11kg/set.
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