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Single-component room temperature curing neutral organosilicon material, high and low-temperature resistance, excellent aging resistance, flexibility, insulation, moisture-proof, shock resistance, corona resistance, and resistance to leakage. The surface does not flow and can be bonded to steel, glass, PVC, ABS, and other materials. Suitable for electronic components of the thermal conductivity adhesive sealing.
QLD595D Thermally Conductive Silicone Rubber
Replaces thermally conductive silicone grease and fills and bonds CPUs to heat sinks, etc.
QLD595HD Thermally Conductive Silicone Rubber
For filler bonding of thyristor smart modules and heat sinks that require high thermal conductivity.
QLD595H Thermally Conductive Silicone Rubber
For filler bonding between high-power electrical modules and heat sinks.
Performance indicators
Silicone thermal conductive adhesive | |||
Performance indicators |
QLD595D |
QLD595HD |
QLD595H |
Appearances |
White |
White |
White |
Density（g/mm3） |
1.3~1.7 |
1.3~1.7 |
1.3~1.7 |
Surface drying time（min） |
20~40 |
20~40 |
20~40 |
Tensile strength（MPa） |
0.7~1.5 |
0.7~1.5 |
0.7~1.5 |
Elongation（%） |
200~300 |
200~300 |
200~300 |
Hardness（shore A） |
30~50 |
30~50 |
30~50 |
Shearing strength （MPa） |
0.7~1.5 |
0.7~1.5 |
0.7~1.5 |
Dielectric strength（KV/mm） |
20 |
20 |
20 |
Loss factor（1.2MHz） |
0.001 |
0.001 |
0.001 |
Volume resistance（Ω·cm, 25℃） |
2.0×1014 |
||
Working temperature range（℃） |
-60~280 |
-60~280 |
-60~280 |
Wire shrinkage（%） |
0.5 |
0.5 |
0.5 |
Thermal conductivity（W/M·K） |
0.8 |
1.2 |
2.0 |
Operation process
1. Clean the surface: Tidy up the surface of the object to be adhered to, remove rust, dust, moisture and oil;
2. Sizing: Prick open the aluminum seal, squeeze the glue to the surface that has been cleaned up, so that it is evenly distributed;
3. Adhesive sealing: 20 minutes after the application of adhesive must be bonded, the adhesive surface can be fixed together;
4 Curing: Room temperature curing for 24 hours to reach the highest strength.
Summer temperature is high, curing will be faster; winter temperature is low, curing will be
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