bliiot ARMxy Embedded Computer T507-H 4-core ARM Cortex-A 53 Different X/Y Boards Combo IO Boards

CPU

Allwinner T507-H, 28nm

4x ARM Cortex-A53 cores, with a clock speed up to 1.416GHz.

GPU: G31 MP2, supporting OpenGL ES 1.0/2.0/3.2, Vulkan 1.1, and OpenCL2.0

Encoder: Supports hardware encoding of 4K@25fps H.264 video.

Decoder: Supports hardware decoding of 4K@30fps H.265 video.

ROM

eMMC 8/16GByte

RAM

DDR4 1/2GByte

ETH

RJ-45, 1~3, 1x1000M, 2x100M, ESD Level 3, EFT Level 3

USB

2x USB2.0 HOST(USB1, USB2), supports high-speed 480Mbps, full-speed 12Mbps, and low-speed 1.5Mbps modes, ESD Level 3

HDMI

1x HDMI2.0a, compatible with HDCP2.2, HDCP1.4 standard, supports up to 4K@30fps

IO Slot

X series IO board slot: 1, X series IO board, support RS485, CAN, RS232, RS422, DI, DO, GPIO, etc;

Y series IO board slot: 2, Y series IO board, support RS485, CAN, RS232, RS422, DI, DO, Relay output, AI, AO, PT100, PT1000, TC, etc.

LED

1x power indicator light

2x user-programmable indicator light

Mini PCIE

1, Supports Bluetooth, WiFi, 4G module, etc.

SIM Slot

1 slot, NANO

Antenna

2, For 4G/WIFI/GPS

Debug

1x Micro USB debug port

SD Slot

1

Reset

1 reset button

Watchdog

Onboard independent hardware watchdog

Power

Rated DC 24V, supports wide voltage range of 9-36VDC

Equipped with reverse polarity protection and overcurrent protection

3-pin terminal block with screw terminals

Grounding

1-pin GND terminal

Installation

DIN35 rail mounting, wall mounting

Material

Aluminum alloy casing + stainless steel

Dimension

110*83*42mm or 110*83*48mm

Kernel

Linux-4.9.170, Linux-RT-4.9.170

File System

Buildroot-201902, Ubuntu 18.04, Android 10

GUI development tool

Qt-5.12.5

Protocol Conversion Software

BLIoTLink, used for protocol conversion, such as Modbus,PLC, BACnet, IEC104, MQTT, OPC UA, support AWS IoTCore, Thingsboard, IgnitionSCADA, IoT, HUAWEI

IoT.

Remote Access Tool

BLRAT, enables remote device access for convenient remote maintenance.

Other Software

Node-Red, Python, Docker, C#, MySQL, SQLite

X10

2

x

x

x

x

6PIN

X11

1

1

x

x

x

6PIN

X12

x

x

2

2

x

6PIN

X13

x

x

4

x

x

6PIN

X14

x

x

x

4

x

6PIN

X15

x

x

x

x

4

6PIN

X20

4

x

x

x

x

10PIN

X21

2

2

4

4

x

20PIN

X22

4

x

4

4

x

20PIN

X23

2

x

8

8

x

20PIN

X24

2

x

16

x

x

20PIN

X25

2

x

x

16

x

20PIN

X26

x

x

x

x

16

20PIN

X27

8

x

x

x

x

20PIN

Y01

4DI+4DO, NPN

Y41

4AO, 0/4~20mA

Y02

4DI+4DO, PNP

Y43

4AO, 0~5/10V

Y03

4DI+4DO, Relay

Y46

4AO, ±5V/±10V

Y11

8DI, NPN

Y51

2RTD, 3-Wire PT100

Y12

8DI, PNP

Y52

 2RTD, 3-Wire PT1000

Y21

8DO, PNP

Y53

2RTD, 4-Wire PT100

Y22

8DO, NPN

Y54

 2RTD, 4-Wire PT1000

Y24

4DO, Relay

Y56

Resistance measurement

Y31

4AI, single-ended, 0/4~20mA

Y57

Voltage measurement

Y33

4AI, single-ended, 0~5/10V

Y58

4TC

Y34

4AI, differential, 0~5/10V

Y91

4 high-speed counting module

Y36

4AI, differential, ±5V/±10V

Y61

4 RS485 or RS232

Y62

1CAN+3RS485 or RS232

Cold start and operation at low temperatures

GBT 2423.1-2008

Test environment temperature -40°C

Hot start and operation at high temperatures

GBT 2423.2-2008

Test environment temperature 60°C

Constant humidity and heat

GB/T 2423.3-2016

Test environment humidity +40°C/95%RH

High-Low temperature shock

GB/T 2423.22-2012

Startup after rapid switching between -40°C and 60°C for 30 seconds (no condensation).

Temperature change

GB/T 2423.22-2012

Temperature cycling test from -40°C to 60°C under powered test conditions.

Sinusoidal vibration

GB/T 2423.10-2019

Vibration testing with and without packaging while the product is in the powered-off state.

Free fall

ISTA 2A-2011GB/T 2423.7-2018GB/T 6587-2012

Drop test with packaging while the product is powered off.