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HTGP 200SF Silicone-Free Gap Filling

Name: HTGP 200SF Silicone-Free Gap Filling
Brand: Hothree
Availability: InStock

FOB Price

USD $1 - $2 / Sheet

5 Sheets(Min.Order)

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Product Details

Brand Name	Hothree		Place of Origin	China
Model Number	HTGP 200SF

Features and Benefits

• Thermal conductivity: 2.0W/m-K

• Electrical insulation

• Silicone-free composition

hothree HTGP 200SF(Non-Silicone Thermal Pad) is a silicone-free thermally conductive gasket made from a non-silicone resin base
filled with a variety of high performance ceramic powders. It is cost effective, well insulated and flame retardant.
hothree HTGP 200SF (Silicone-Free Gap Filling Material) can be die-cut into various shapes,easy to operate.
The thermal conductivity can reach 2.0w/m-k and the standard hardness is 45 shore00.
Thickness is 1.0~8mm and the standard specification is W200mm*L400mm/sheet.
Produced by our own formula, we can customize the color, hardness and thickness according to the requirements.
hothree HTGP 200SF (Silicone-free thermal pad) Applications
• Optical components
• Storage devices
• Silicon sensitive applications
hothree HTGP 200SF (Non-silicone thermally conductive gaskets) can replace BERGQUIST GP2500S40,GAP PAD 2000S40

Shenzhen Hothree Technology Co., Ltd.: Contact nameCarrie
Chat Now; Phone86-755-86652465; Addresslonggang, Shenzhen, Guangdong