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Help CenterHigh Self-sharpness Etch Diamond Abrasives
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Etch Diamond Abrasives
By special methods, the surface of single crystal diamond is increased in the number of cutting edges, forming nanoscale multi cutting edges.
During use, multiple cutting edges are more conducive to dispersing the heat generated during grinding. Due to the strong grip of the multi edge structure, it can significantly improve the grinding efficiency of the workpiece and is less likely to scratch the surface of the workpiece.
This series of diamonds can be widely used for grinding and polishing hard and brittle materials such as optical devices, semiconductor wafers, LED sapphires, etc.
Product Features
*Compared to single crystal diamond, it has a longer service life;
*High self sharpening and multi blade structure can increase the grip on the workpiece and improve grinding efficiency;
*The multi blade structure and shallow blade edge are less likely to scratch the surface of the workpiece during grinding and improve the surface quality of the workpiece
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