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Help CenterHigh Quality Granulation Diamond Abrasives for Sic Wafer Processing
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Granulation diamond abrasives, (agglomerated abrasives) are formed by bonding fine abrasive particles together using a high-strength binder through a special granulation process, creating an independent composite body.
After the surface layer of agglomerated abrasives undergoes passivation, under certain pressure, the passivated abrasives will break off from the agglomerated abrasives, while new abrasives continue to participate in grinding. Therefore, the grinding fluid and grinding tools prepared from agglomerated abrasives have the advantages of improving processing efficiency and enhancing the quality of processed surfaces.
Product Features
*The particles present a spherical or quasi spherical shape, with a flat surface, all solid balls, and no irregular crystal particles such as apple shaped or donut shaped particles. And the surface is free of burrs, which can reduce scratches on the workpiece during the processing;
*The surface exhibits a multi cutting edge structure at the micro level, which can maintain high cutting force while also having a long service life;
*The porosity distribution on the particle surface is uniform and presents a pore like pattern, which is conducive to heat dissipation during the processing.
Granulation diamond Sizes in Supply
Model Number |
Primary Particle Size |
Agglomerated Particle Size |
Remarks |
YS-GH |
0.1-0.5μm |
5-15μm |
The particle size can be customized according to the actual situation |
YS-GH |
0.5-1μm |
15-20μm |
|
YS-GH |
1-2μm |
≥20μm |
|
YS-GH |
≥3μm |
≤200μm |
The particle size can be customized according to the actual situation.
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