HK Wire Bonding Tools Semiconductor Assembly Cutter
HK Wire Bonding Tools Semiconductor Assembly Cutter
Product specifications: 0.6 mm; 0.8 mm (cut width)
Product notes:Product of this kind is applied to H&K Al wire machine to cut the Al wire.
High performance steel.
Hardened and tempered.
Ultra-fine ground finish.
Contact:
Yoyo Gong
E-mail: yoyogong@yehengdz.com
Skype: +8618615748628
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