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Ribbon Wire Bonding Tools Semiconductor Assembly Wedge

Ribbon Wire Bonding Tools Semiconductor Assembly Wedge photo-1
Ribbon Wire Bonding Tools Semiconductor Assembly Wedge photo-2
US$ 50 - 150 MOQ: 1 Piece
Key Specifications
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Brand Name:
YH-RB
Place of Origin:
China
Model Number:
Ribbon
Payment & Shipping
Payment Methods:
Port of Shipment:
Chengdu,Shanghai,Shenzhen,Guangzhou
Delivery Detail:
7 days
Brand Name YH-RB
Place of Origin China
Model Number Ribbon

Ribbon Wire Bonding Tools Semiconductor Assembly Wedge


Style No.:

433 462 463 470


Product specifications: 

20*8MIL

30*4MIL

30*8MIL

40*8MIL

40*10MIL

60*8MIL

80*8MIL


High performance steel. 

Hardened and tempered. 


Contact:

Yoyo Gong

E-mail: yoyogong@yehengdz.com

Skype: +8618615748628




Product Tags: Wire Bonding Tools , Semiconductor Assembly , Ribbon Wedge

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Business Type
Manufacturer
Year Established
2002
Annual Export Value
US$10 Million - US$50 Million
Product Certifications
ISO9001

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