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Help CenterBQB Certified Bluetooth Module With BLE 5.0 Ble Module Low Power Consumption
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Introduction
The MS50SFB is a compact small size Bluetooth 5.0 module with ultra-low power consumption and
optional antenna types; it is very suitable for the coin cell battery powered applications.The module is highly integrated that contains all the necessary components from radio to different antenna
and a completely implemented Bluetooth protocol stack and pre-flashed UART communication protocol.
Features
• Frequency: 2402 to 2480 MHz
• Max. Output power: +4dBm
• NFC type A interface
• ARM Cortex-M4F processor
• Metal shielding with marking
• UART communication protocol (Slave / Master optional)
• 3 optional antenna types: PCB antenna, chip antenna, IPEX connector
• Operating Temperature range: -25 to 85 degree Celsius
Application:
• Cycle computer
• Heart rate monitor
• Blood pressure monitor
• Blood glucose meter
• Weighing machine
• Thermometer
• Mobile accessories
• Sports and fitness sensors
• Remote controllers / Toys
• Key fobs and wrist band
• 3D glasses and gaming controller
1. Pin Description
Symbol Type Description
| VCC | Power | Power Supply |
| DCC | Power | DC/DC convert output pin |
| GND | Power | Ground |
| DEC4 | Power | 1.3V regulator supply decoupling. Input from DC/DC converter. Output from 1.3V LDO |
| SWDIO | Digital I/O | System reset ( active low ). Hardware debug and flash Programming I/O Programming I/O. |
| SWCIK | Digital Input | Hardware debug and flash Programming I/O |
| P0.00-P0.31 | Digital I/O | General purpose I/O pin |
| XL2 | Analog output | Connection for 32.768kHz crystal |
| XL1 | Analog input | Connection for 32.768 kHz crystal or exnternal 32.768kHz |
| RESET | Digital I/O | Configurable as system RESET pin |
1.1 Pin assignment
2. Electronic Characteristic
2.1 Absolute maximum ratings
| Symbol | Min | Max | Unit | Condition |
VCC | 1.8 | 3.9 | V | Input DC voltage at VCC pin |
| ANT | +10 | dBm | Input RF power at antenna pin at receiver |
Note: The module is not protected against overvoltage or reserved voltages. If necessary, voltage spikes
exceeding the power supply voltage specification must be limited to values within the specified
boundaries by using appropriate protection devices.
2.2 Maximum ESD ratings
| Parameter | Max | Unit | Remarks |
| ESD Senstitivity | 4 | KV | Human body model |
| 750 | V | Charged device model | |
| +/-8 | KV | ESD indirect contact discharge |
2.3 Operating temperature range
| Parameter | Min | Max | Unit |
| Storage temperature | -40 | 85 | ℃ |
| Operating temperature | -40 | 85 | ℃ |
2.4 Current consumption
| Parameter | Min | Max | Unit | Remarks |
| Receiving current | 5.4 | mA | Standard mode | |
| Transmission power | 5.3 | mA | Transmission power at 0dBm | |
| Sleeping current | 1 | mA | Power mode 3 |
2.5 RF performance
| Parameter | Min | Typical | Max | Unit |
| Receiver input sensitivity | -93 | dBm | ||
| Output power | -30 | 0 | +4 | dBm |
3. Physical Dimension
4. Reference Schematic Design
5. Layout and Soldering Considerations
To make sure wireless performance is at its best condition, please layout the module on the carrier board as below instructions.
5.1 Carrier board under the antenna area of the module like the picture;
5.2 Keep out enough area for the antenna area;
5.3 Reflow profiles are to be selected according to standard manufacturing process;
5.4 The soldering temperature should be less than 206℃;
5.5 The module should be placed far away other low frequency and digital circuits;
5.6 The MS50 series modules contain highly sensitive electronic circuitry and are Electrostatic
Sensitive Devices (ESD). Handling the MS50 series modules without proper ESD protection
may destroy or damage them permanently.
Recommended Layout for the Carrier Board
*PCB: It’s the mother board / carrier board.
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