Diamond Dicing Blades

Resin bond dicing blade

Introduction of Resin bond dicing blade

Resin bond blades with the characteristic of vertical consumption can efficiently reduce the occurrence of grain deformation and improve the cutting quality and efficiency on hard and brittle materials.

Features of Resin bond dicing blade

Improve the cutting quality and efficiency on hard and brittle materials.

A wide selection of bonds available for high-grade processing on hard and brittle materials.

Ultra thin blade (over 50um)

Applications of Resin bond dicing blade

Hard and Brittle Materials, Ceramics, Optical Glass, Glass for Optical Fiber Communication, Splitter, IR Filter, QFN

Specification

       OD: 50-125mm

       ID: 25.4/40/88.9

       Thickness: 0.10-2.00mm (Based on diamond grit size)

       Grit: 200#-5000# (D107-D1)

Metal bond dicing blade

Introduction of Metal bond dicing blade

Metal bond blades, the sintered diamond blades with the addition of metal powder in bond, have high retaining force for grain. 
With the higher wear-resistance and advanced cutting capability and higher stiffness, the metal bond blades can effectively reduce cutting defects like slanted-kerf.

Features of Metal bond dicing blade

Ultra thin blade (over 45um)

A wide selection of bonds available for various semiconductor packages.

Applications of Metal bond dicing blade

Sapphire,BGA,Optical Glass,CSP

Specification

       OD: 50-125mm

       ID: 25.4/40/88.9

       Thickness: 0.10-2.00mm (Based on diamond grit size)

     Grit: 200#-5000# (D107-D1)

Electroformed bond dicing blades

Introduction of Electroformed bond dicing blade

Electroformed bond blades are featured by ultra thin, high strength and 
stiffness. They can also suppress the deformation of blade shape and 
give high endurance and robust properties during cutting process.

Features of Electroformed bond dicing blade

Sophisticated electroformed.

A wide selection of bonds available for various kinds of workpieces.

Exclusive development and customization technology.

Applications of of Electroformed bond dicing blade

Compound, Silicon, Magnetic Materials, Ceramic Raw Material
Ceramic, Glass Epoxy Boards, etc.

Specifications

       OD: 50-125mm

       ID: 25.4/40/88.9

       Thickness: 0.10-2.00mm (Based on diamond grit size)

       Grit: 200#-5000# (D107-D1)