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Resin bond dicing blade
Introduction of Resin bond dicing blade
Resin bond blades with the characteristic of vertical consumption can efficiently reduce the occurrence of grain deformation and improve the cutting quality and efficiency on hard and brittle materials.
Features of Resin bond dicing blade
Improve the cutting quality and efficiency on hard and brittle materials.
A wide selection of bonds available for high-grade processing on hard and brittle materials.
Ultra thin blade (over 50um)
Applications of Resin bond dicing blade
Hard and Brittle Materials, Ceramics, Optical Glass, Glass for Optical Fiber Communication, Splitter, IR Filter, QFN
Specification
OD: 50-125mm
ID: 25.4/40/88.9
Thickness: 0.10-2.00mm (Based on diamond grit size)
Grit: 200#-5000# (D107-D1)
Metal bond dicing blade
Introduction of Metal bond dicing blade
Metal bond blades, the sintered diamond blades with the addition of metal powder in bond, have high retaining force for grain.
With the higher wear-resistance and advanced cutting capability and higher stiffness, the metal bond blades can effectively reduce cutting defects like slanted-kerf.
Features of Metal bond dicing blade
Ultra thin blade (over 45um)
A wide selection of bonds available for various semiconductor packages.
Applications of Metal bond dicing blade
Sapphire,BGA,Optical Glass,CSP
Specification
OD: 50-125mm
ID: 25.4/40/88.9
Thickness: 0.10-2.00mm (Based on diamond grit size)
Grit: 200#-5000# (D107-D1)
Electroformed bond dicing blades
Introduction of Electroformed bond dicing blade
Electroformed bond blades are featured by ultra thin, high strength and
stiffness. They can also suppress the deformation of blade shape and
give high endurance and robust properties during cutting process.
Features of Electroformed bond dicing blade
Sophisticated electroformed.
A wide selection of bonds available for various kinds of workpieces.
Exclusive development and customization technology.
Applications of of Electroformed bond dicing blade
Compound, Silicon, Magnetic Materials, Ceramic Raw Material
Ceramic, Glass Epoxy Boards, etc.
Specifications
OD: 50-125mm
ID: 25.4/40/88.9
Thickness: 0.10-2.00mm (Based on diamond grit size)
Grit: 200#-5000# (D107-D1)
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