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Home > Tools & Hardware > Abrasive & Grinding > Grinding Wheel > Resin Bond Daimond Dicing Blade for Wafer Semicoductor,ceramic Chips

Resin Bond Daimond Dicing Blade for Wafer Semicoductor,ceramic Chips

Name: Resin Bond Daimond Dicing Blade for Wafer Semicoductor,ceramic Chips
Brand: MORE
SKU: 158485454
Availability: InStock

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Resin Bond Daimond Dicing Blade for Wafer Semicoductor,ceramic Chips photo-4

US$ 1 - 2 MOQ: 1 Piece

Key Specifications

Get Latest Price

Brand Name:

Place of Origin:

China

Model Number:

disc1

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More Super Hard Company

Payment & Shipping

Payment Methods:

Port of Shipment:

shanghai

Delivery Detail:

7 days

Product Details
Company Profile
Contact Us

Brand Name MORE

Place of Origin China

Model Number disc1

Size 58

Type Abrasive Disc

Resin bond daimond dicing Blade for semicoductor,ceramic chips

Resin bond high precision dicing blades without steel core are made of the same materials, with thin thickness and and high precision, they are mainly used for slotting and cutting the semiconductor, optical glass, quartz glass, ceramics and so on.More super hard series are sintered diamond blades employ thermo-setting resin as the bond material. Taking advantage of its excellent elasticity, the ability of this bond to cut has been maximized. They are suitable for processing of hard-to-cut materials such as glass and crystal materials.

Metal bond blade

Good wear resistance, good shape maintenance and long worklife.

Resin bond blade

Goodself-sharpen, perfect fracture surface quality.

Saw blade without steel plate

With thin thickness and high precision, they are mainly used for grooving and cutting with high accuracy and slight cutting depth.

Features:

Self-sharpness, high cutting ability and efficiency.

Excellent bond elasticity, improve cutting quality.

Application: Glass, Quartz,especially for semoconductor.

If you need any products, do not hesitate to contact

@moresuperhard.com