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Hubless Resin Diamond Dicing Blade for Semiconductor

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US$ 80 - 120 MOQ: 1 Piece
Key Specifications
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Brand Name:
More
Place of Origin:
China
Material:
Diamond
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Hong Cheng Super Hard Material Co., Ltd
Verified Business License
Payment & Shipping
Payment Methods:
Port of Shipment:
Shanghai
Delivery Detail:
15 days

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Brand Name More
Place of Origin China
Material Diamond
Usage semiconductor
Abrasive Grain Sizes 360

Resin diamond dicing blade

Features: High Processing Quality For Cutting Of Hard, Brittle Material, 

Able To Precisely Control Diamond Concentration, 

To  Achieve Cutting Quality; Improved Cut Quality On Hard Materials

 

Application: Glass, Crystal, Quart, LiTaO3, Ceramics, Optical, QFN, Splitter

 

 

Metal diamond dicing blade

Features: High Rigidity minimized Wavy And Slant Cutting ; Able To Control Diamond Concentration To Achieve Cutting Quality ;Excellent Rigidity And Cut Quality

 

Application:  Electronic Parts, Optical Devices, Semiconductor Packages, BGA, CSP

 

Electroformed Dicing Blade

 

Features: Wide Selection Of Blade Options; Proprietary Thin-Blade Technology ;Blade Thickness - 0.015 Mm To 0.3 Mm; Available For Both Dicing Saws And Slicers

 

Application:  Various Types Of Semiconductor Packages, Ceramics, Magnetic Materials, PCB, Silicon


Product Tags: Dicing Blade , Diamond Dicing Blade

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Hong Cheng Super Hard Material Co., Ltd
Verified Business License
Business Type
Distributor/Wholesaler
Year Established
2022
Annual Export Value
Below US$1 Million
Total Employees
101 - 200 People
Contact Supplier Request Quote Chat Now

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