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Help CenterResin Bond Diamond Internal Grinding Wheel for HVOF Ceramic Coating
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Resin bond diamond internal grinding wheel for HVOF ceramic coating
Description of the Resin bond diamond internal grinding wheel for HVOF ceramic coating:
Resin bond diamond internal grinding wheel for HVOF ceramic coating is mainly used for grinding tungsten carbide and ceramic coatings.
Various kinds of dimensions and shapes are available, such as flat shapes, cup shapes, and dish shapes, etc.
Feature/Benefit of the Resin bond diamond internal grinding wheel for HVOF ceramic coating
1. Good free-cutting
2. Good Abrasion Resistance
3. Availability in a broad range of applications in both Dry and Wet Conditions
4. Improved Heat Resistance(Polyimide Series)
Application of the Resin bond diamond internal grinding wheel for HVOF ceramic coating:
1. ID/OD cylindrical grinder
2. Ceramic grinding,
3. Tungsten carbide grinding,
Specification of Resin bond diamond internal grinding wheel for HVOF ceramic coating:
Type: 1A1,3A1,9A1,14A1 etc.
Diameters: 25mm-1000mm
Thickness: 5mm-250m
Grit: 50# -2000#
Hole: according to the customer requirement
Concentration: 100, 125
to meet your requirements in every way, we need the following information
----- Shape and Dimension of the wheels
----- Grit size (Mesh, refer to Table#1)
----- Concentration
----- Bond(Resinoid, Vitrified, Metallic, Electroplated)
----- Quantity
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