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Home > Tools & Hardware > Abrasive & Grinding > Grinding Wheel > Resin Bond Diamond Dicing Blades for Silicon Wafer
Resin Bond Diamond Dicing Blades for Silicon Wafer
US$ 30 - 60
MOQ: 10 Pieces
Key Specifications
Get Latest Price
Brand Name:
More Super Hard
Place of Origin:
China
Model Number:
1A8
Payment & Shipping
Payment Methods:
Port of Shipment:
Shanghai
Delivery Detail:
15 days
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Brand Name
More Super Hard
Place of Origin
China
Model Number
1A8
Size
55*0.2*40
Type
Abrasive Disc
Resin bond dicing blade can self-sharpen and cut sharply.
The quality of the surface can be improved due to the elastic resin bond.
Resin diamond dicing blade
Features: High Processing Quality For Cutting Of Hard, Brittle Material,
Able To Precisely Control Diamond Concentration,
To Achieve Cutting Quality; Improved Cut Quality On Hard Materials
Application: Glass, Crystal, Quart, LiTaO3, Ceramics, Optical, QFN, Splitter
|
D T |
25-60 |
70-78 |
80-110 |
110-125 |
127-200 |
Thickness limit deviation |
0.07 |
±0.002 |
|||||
0.1 |
||||||
0.2 |
||||||
0.3 |
±0.003 |
|||||
0.4 |
||||||
0.5 |
||||||
1.0 |
||||||
1.5 |
||||||
2.0 |
||||||
H |
6, 8, 9, 10, 12.7, 25.4, 31.75, 40, 41.275, 50.8, 76.2, 69.875, 88.9, 114.3 |
|||||
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Business Type
Distributor/Wholesaler
Year Established
2022
Annual Export Value
Below US$1 Million
Total Employees
101 - 200 People
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