IGBT Packaging
The most popular AlSiC IGBT Baseplates are made of 63% SiC volume fraction AlSiC, whose CTE is around 8 ppm/K (30-200 degree), while its stiffness still accommodates extreme adverse environments, for example, on automobile.
Hint:
Unlike copper, with about 480Mpa bending resistance (45# steel is 355Mpa), the AlSiC is quite tough in deformation resistance.
AlSiC-7's thermal expansion coefficient is 7ppm/K, and it can match better the ceramic substrate for chips. We recommend AlSiC-7 instead of AlSiC-8 for IGBT substrates. AlSiC-7's thermal conductivity is almost the same as AlSiC-8's. There are two varieties of conventional products. One is the E1 board, commonly referred to 130X140 board (127x137x5mm); The other is the E2 board, commonly referred to 140X190 board (137x187x5mm). Archs of two plates are spherical surface, the high of archs is from 0.05mm to 0.39mm.
The dimension tolerance for net shaped parts is 0.1mm.
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