IGBT Packaging

IGBT Packaging photo-1
Negotiable MOQ: 1 Set (Price negotiable depending on order volume and customization)
Key Specifications
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Business Type:
Trading Company
Total Employees:
101 - 200 People
Main Markets:
North America, South America, Eastern Europe
Payment & Shipping
Payment Methods:
Port of Shipment:
China
Delivery Detail:
7 days
The low coefficient of thermal expansion, high thermal conductivity, light weight and low cost makes AlSiC ideal material for IGBT thermal management.
The most popular AlSiC IGBT Baseplates are made of 63% SiC volume fraction AlSiC, whose CTE is around 8 ppm/K (30-200 degree), while its stiffness still accommodates extreme adverse environments, for example, on automobile.
Hint:
Unlike copper, with about 480Mpa bending resistance (45# steel is 355Mpa), the AlSiC is quite tough in deformation resistance.
AlSiC-7's thermal expansion coefficient is 7ppm/K, and it can match better the ceramic substrate for chips. We recommend AlSiC-7 instead of AlSiC-8 for IGBT substrates. AlSiC-7's thermal conductivity is almost the same as AlSiC-8's. There are two varieties of conventional products. One is the E1 board, commonly referred to 130X140 board (127x137x5mm); The other is the E2 board, commonly referred to 140X190 board (137x187x5mm). Archs of two plates are spherical surface, the high of archs is from 0.05mm to 0.39mm.
The dimension tolerance for net shaped parts is 0.1mm.

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Business Type
Trading Company
Total Employees
101 - 200 People
Main Markets
North America, South America, Eastern Europe
Location
Qingdao, Shandong, China