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Help CenterBlack Epoxy Potting Adhesive for Module to Waterproof
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Product Introduction
Ausbond 150 is a double-component black curable thermal-conductive & flame-retardant
Epoxy Encapsulating, with low adhesive and excellent flow and it can penetrate into the gap of products; it can be solidified through normal temperature or heating with suitable speed of solidification; there is no bubble with plain and glazing surface and high hardness; the solidified materials have an excellent performance of anti-alkaline, waterproof, oil- proof and dust-proof,which is humid and thermal resistant and air aging;
it owns excellent electric and physical features of insulation, anti-pressing and high degree of adhesive.
Typical Purposes
It is widely used for injection sealing protection and confidentiality of electronics of circuit module,power module, electronic component and PCB board.
Package Specification
30kg/suite (group A 25kg+group B 5kg).
Storage and Transport
1. Store in the cool and dry place, with shelf life 12 months (25℃).
2. This product belongs to non-dangerous articles;please transport it as general articles.
3. For the product over storage life, please use it after confirming whether it is abnormal.
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