SMT / BGA / DIP OEM PCB Board Assembly, CEM-3 FR-4 Single Layer ElectronicPCB Assembly

Delivery Time:4weeks - 8 weeks
Certification:RoHS, CE, FCC

SMT / BGA / DIP OEM PCB Board Assembly, CEM-3 FR-4 Single Layer Electronic PCB Assembly

Key Specifications/Special Features:

•     Taking IPC-A-160 standard which is the most widely recognized standard of electronic assemblies

•     Complicated boards and components available

•     Provides OEM services to all sorts of printed circuit board assemblies as well as electronic encased products

•     We provide the real vertically integrated OEM service form procurement, plastic tooling/injection,

•     Can place 0201 SMD chip , BGA and x-ray ,AOI inspection

•     PCB assembly, final casing assembly/testing, quality assurance to shipping

•     In-circuit testing capability for PCBAs

•     PCBA/SMT/final assembly -vertical integrated manufacturing solution

•     Profound knowledge of contract manufacturing services

•     Capable of developing effective production process to ensure high quality and consistency

•     Experienced logistic control

•     Cost-effective factory located in China

•     Flexible production for customers\' required volumes

•     Reliable circuit board available in soldering and casing assembly

•     The overall quality of assembled product is guaranteed by the quality of the components made

•     Reliable contract assembly service provides optimal flexibility

Our services for the PCB Assembly

Re-layout for shortening the board size Bare pc board fabrication SMT/BGA/DIP assembly Full component procurement or the substitute components sourcing Wire harness and cable assembly Metal parts, rubber parts and plastic parts including mold making Mechanical, case and rubber molding assembly Functional testing Repairs and inspection of the sub-finished / finished goods

Our capabilities for the PCB Assembly

Stencil Size Range	736 mm x 736 mm
Min. IC Pitch	0.30 mm
Max. PCB Size	410 mm x 360 mm
Min. PCB Thickness	0.35 mm
Min. Chip Size	0201 (0.6 mm X 0.3 mm)
Max. BGA Size	74 mm X 74 mm
BGA Ball Pitch	1.00 mm (Min) / F3.00 mm (Max)
BGA Ball Diameter	0.40 mm (Min) /F1.00 mm (Max)
QFP Lead Pitch	0.38 mm (Min) /F2.54 mm (Max)
Frequency of Stencil Cleaning	1 time / 5 ~ 10 Pieces

Our capabilities for handling the Bare PC Board fabrication

Fabrication data inputs: Gerber data RS-274-X or RS-274-D with aperture list and drill files, design file with Protel, PAD2000, POWERPCB, ORCAD

Layers 2-30 L
Material Types Fr-4, Fr-5, High-Tg, Halogen Free, Rogers,
Isola, Taconic, Arlon, Teflon, Aluminum Based
Max. Panel Dimension 39000mil * 47000mil / 1000mm * 1200mm
Outline Tolerance ±4mil ±0.10mm
Board Thickness 8mil-236mil / 0.2mm-6.0mm
Board Thickness Tolerance ±10%
Dielectric Thickness 3mil-8mil / 0.075mm-0.20mm
Min. Track Width 3mil / 0.075mm
Min. Track Space 3mil / 0.075mm
External Cu Thickness HOZ-6OZ / 17um~210um
Internal Cu Thickness HOZ-6OZ / 17um~210um
Drilling Bit Size ( CNC ) 6mil-256mil / 0.15mm-6.50mm
Finished Hole Dimension 4mil-236mil / 0.1mm—6.0mm
Hole Tolerance ±2mil / ±0.05mm
Hole Position Tolerance ±2mil / ±0.05mm
Laser Drilling Hole Size 4mil / 0.1mm
Aspect Ration 12:1
Solder Mask Green, Blue, White, Black, Red, Yellow, Purple, etc.
Min Solder mask Bridge 2mil / 0.050mm
Plugged Hole Diameter 8mil-20mil / 0.20mm-0.50mm
Impedance Control V-scoring ±10%
Surface Finishing HASL, HASL(lead Free), Immersion Gold, Immersion Tin,
Immersion Silver, OSP, Hard Gold( up to 100u”)

UL and TS16949: 2002 marks Special requirements: buried and blind vias, impedance control, via plug, BGA soldering and gold finger Profiling: punching, routing, V-cut and beveling OEM services to all sorts of printed ci