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Pure single-crystal cylinders of silicon are sliced into thin, highly polished silicon wafer 4 inch less than one-fortieth of an inch thick. Hundreds of memory chips are etched onto each wafer, while for processor chips, perhaps only ten to 50 devices will fit on one wafer. Most chip designs are developed with the help of computer systems or computer-aided design (CAD) systems. Circuits are developed, tested by simulation, and perfected on computer systems before they are actually built. When the design is complete, glass photomasks are made—one mask for each layer of the circuit. These glass photomasks are used in a process called photolithography.
CZ-SSP-2"-P-Boron, Diameter: 2" , Type Dopant: P-Boron, Thickness: 275um, Single Crystal Silicon Wafer
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