Hot air Shuttle star RW-SP360C bga soldering station for bga chip repairment

 Heating Device and PCB Clamps:

Independent 3 Heater: Upper/Lower hot air heating, Bottom IR preheating

1.The upper&lower heaters: BGA can be heated from upper and bottom at the same time.

   temperature accuracy within ±2℃,make BGA melt completely;

2.IR preheating area is adjustable according to desire requests and PCB size, and matched with PCB clamps to make PCB          heating evenly and  protect motherboard from deformation during heating process;   

3. PLC operate interface display real-time temperature profile,so you can  monitor BGA temperature change all the time.

4. Unlimited save temperature profile for later use. even if you have no BGA rework experience ,

    You can desoldering/soldering BGA chip.   Easy operation .

5. 8 stages temperature running, Refer Relow soldering process . it is beneficial to know the whole package's temperature   distribution characteristic

PLC Operate Interface:

V-Type PCB Jig

Irregular Laptop PCB Clamps

Clamps can help fix PCB on machine ,and it can protect PCB from deformation when heating whole PCB

Thermocouple and Vacuum Pen

Thermocouple :test BGA heating temperature,monitor temperature change

Vacuum Pen:Pick-up BGA when heating finished