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Help CenterShuttle Star RW-SP360C Welding Rework Station, Mobile Phone/laptop Motherboard Repair Equipment/infrared Bga Rework
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Best seller, smart BGA Repair Station---- SP360C
Specification:
Max PCB size: |
430mmX350mm |
Min PCB size: |
20mmX20mm |
Max BGA size: |
55mmX55mm |
Min BGA size: |
7mmX7mm |
Max BGA weight: |
80g |
Power for operation: |
3600W |
Upper hot air heater |
800W |
Lower hot air heater |
800W |
Bottom IR heater: |
2000W |
Machine dimension: |
650*500*600mm |
Machine weight: |
36KG |
Power supply: |
AC singal-phase220V 3.6KW |
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Description
* High quality heating material produces high-tem breeze, precisely controlling the soldering and desoldering process.
* Movable heating head, able to move horizontally; easy to operate;
* Embedded industrial computer, touch screen interface, PLC control; real-time temperature curve display, able to display set curve and practically-tested curve; 7.2 high definition screen, convenient for operation and observation;
* Industrial computer able to store unlimited temperature curves, curve analysis can be done on touch screen; both English and Chinese can be input;
* The temperatures of the upper and lower heater can be precisely controlled according to set temperatures; bottom constant temperature infrared heating area; appropriate temperature control apparatus can ensure safe rework for BGA;
* The BGA soldering supporting frame can micro-adjusted to avoid local sinkage;
* Powerful cross flow can cool the lower heating area;
* The adjustable PCB positioning supports, easy and fast to install PCB; special fixture for installing allotype boards ;
* with sound alarming function after finishing soldering or desoldering; hand vacuum pen easy for picking up BGA;
* Set with over temperature alarming and protection function;
* Equipped with different hot gas nozzles, easy to replace; can be customized according to specific needs;
* The integrated design of machine and chassis is room-saving.
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