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Help CenterXTL-DP75 Semiconductor YAG Diode Laser Metal Marking Machine
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XTL-DP75 Semiconductor YAG Diode laser Metal marking machine are detailed as follow:
Machine Feature:
1. The use of high-performance semiconductor lasers, better beam quality, better light pattern, optical power stability.
2. Facula with small, fine and high marking speed, marking good effect, and low power consumption, low processing costs.
3. Marking powerful software with a graphical alignment, set the parameters and the hierarchical position of the preview feature of red light. Marking can be a variety of bar code and graphics code, and have anti-play function.
4. The use of major temperature water cooling system, temperature control accuracy.
5. Using WINDOWS interface, compatible with CORELDRAW, AUTOCAD PHOTOSHOP software output and other documents. Supported PLT, AL, DXF, BMP and other documents, direct the use of SHX, TTF font to support the auto-coding, serial number, batch number, date, two-dimensional bar code and code marking
Applicable materials:
A):all kinds of ordinary metals and alloys(Iron, copper, aluminium, magnesium, zinc and all metals);
B):rare metals and alloys (gold, silver, titanium); metal oxides, ABS material (electrical appliancescase, daily necessities).
C): ink (translucent key-press, printing products),
D)epoxy resin(electronic components packaging, insulation layer).
Technical parameters:
Max.Outout Power |
75W |
Repetition Precision |
±0.03mm |
Laser Wavelength |
1064nm |
Machine power |
5KW |
Repetition Frequency |
≤50KHZ |
Electric Power Demand |
220V/Single Phase/50Hz/8A |
Standard Marking Scope |
100mmX100mm(optical) |
Optical-Path System Size |
1200mm*190mm*200mm |
Marking Depth |
≤1mm |
Controlling Size |
600mm*600mm*800mm |
Marking speed |
≤7000mm/s |
Min.Character |
0.3mm |
Min.Line Width |
0.015mm |
Sample Picture:
P1:
P2:
P3:
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