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Pre-treatment Before Hot Air Leveling

Pre-treatment Before Hot Air Leveling photo-1
Negotiable MOQ: 1 Set (Price negotiable depending on order volume and customization)
Key Specifications
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Place of Origin:
Jiangsu, China
Brand Name:
TIAN YI
Model Number:
TY-PBH-1
Payment & Shipping
Payment Methods:
Port of Shipment:
Shanghai Port
Delivery Detail:
Delivery time depends on order quantity.
Place of Origin Jiangsu, China
Brand Name TIAN YI
Model Number TY-PBH-1

Specifications

Pre-treatment before hot air leveling

Pre-treatment before hot air leveling 

 

 

Characteristics:
It is used for pre-treatment before hot air leveling, which can keep the surface of the copper foil and the holes wall clean, activation and coarsening. So it ensures the eveness and leveling of the PCB tin solder.
Process Flow
Put the plate—etching—recycle water washing—hi-pressure water washing—clean water washing—dry the plate—check—apply flux
Main Parameter:
1
Work table width 640mm
2
Work Height 900±25mm
3
Convey Speed 0-5m/min
4
Application Max:600mm*any dimension Min: 80mm*120mm
5
Thickness 0.4-2.5mm

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Business Type
Manufacturer, Trading Company
Year Established
2001
Factory Size
3,000-5,000 square meters
Total Employees
51 - 100 People