Pre-treatment Before Hot Air Leveling
Specifications
Pre-treatment before hot air levelingPre-treatment before hot air leveling
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Characteristics: It is used for pre-treatment before hot air leveling, which can keep the surface of the copper foil and the holes wall clean, activation and coarsening. So it ensures the eveness and leveling of the PCB tin solder. Process Flow Put the plate—etching—recycle water washing—hi-pressure water washing—clean water washing—dry the plate—check—apply flux | |||||||||||||||
Main Parameter:
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