PSG Removal and Cleaning
Specifications
1.Wet chemical removal of the phosphorous glass layer2.Efficient and gentle
3.Homogeneous and reproducible
PSG Removal and cleaning
Application:
Wet chemical removal of the phosphorous glass layer (PSG).Features and Benefits
- Efficient and gentle processing of the cells
- Using advanced PID temp. control system
- Drying process without water marks
- Homogeneous and reproducible process
- End-to-end inline processing
Technical Data
-
Standard Outline dimension:
10500*2000*2200 (length*width*heigh) -
Throughput:
2100 for 125mm wafers/h gross, 1800 for 156mm wafers/h gross - Thickness: >150um
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