CC2540 Bluetooth RF Moudle BLE Module Low-Power 8051 Microcontroller Core
General Description
VT-CC2540-M1 is based on RF Transceiver CC2540 of TI Chipcon, it’s a small size and ultra low power UHF wireless module. CC2540 Can Run Both Application and BLE Protocol Stack, Includes Peripherals to Interface With Wide Range of Sensors, Etc. It combinesHigh-Performance and Low-Power 8051 Microcontroller Core. Customer can use it conveniently and reducing your development time.
Features
l Bluetooth low energy technology Compatible
l Suitable for Systems Targeting Compliance With Worldwide Radio Frequency Regulations: ETSI EN 300 328 and EN 300 440 Class 2 (Europe), FCC CFR47 Part 15 (US), and ARIB STD-T66 (Japan)
l Lower power consumption with Power Mode 2 (Sleep Timer On): 0.9 μA
l High performance and low power 8051 microcontroller core.
l Bluetooth v4.0 Compliant Protocol Stack for Single-Mode BLE Solution
l Full-Speed USB Interface
l 256 KB In-System-Programmable Flash and 8-KB SRAM
l Support digital RSSI output and Carrier Sense (CS) indicator
l Programmable output power from -20 up to +4dBm for all supported frequencies.
l Small dimension :12.6mm×20.5mm×2.2 mm, integrated PCB antenna
Applications
l 2.4-GHz Bluetooth low energy Systems
l Mobile Phone Accessories
l Sports and Leisure Equipment
l Consumer Electronics
l Human Interface Devices (Keyboard, Mouse, Remote Control)
l USB Dongles
l Health Care and Medical
General Characteristics
Test operating conditions:Ta=25°C,VCC=3.3V if nothing else stated.
Parameter |
Type |
Condition/Note |
Operating supply voltage |
DC 2.0~3.6V |
|
Frequency bands |
2402~2480MHz |
|
BLE Channel |
40 |
|
Modulation format |
GFSK |
|
Transmit power |
-20~+4dBm |
Programmable |
TX current consumption |
<32mA |
Po=+4dBm |
Receiver sensitivity |
-97dBm |
High gain mode |
RX current consumption |
<23mA |
High gain mode |
Sleep State current consumption |
<2uA |
Refer to IC operation states |
Data rate |
1Mbps |
|
FLASH |
256KB |
128KB optional |
SRAM |
8KB |
|
Antenna type |
PCB antenna |
|
Communication distance |
>50m |
+4dBm output power. |
Operating temperature |
-20~+75 °C |
|
Storage temperature range |
-40~+125°C |
|
Dimension |
12.6mm×20.5mm×2.2mm |
See more in PCB description |
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