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Best Quality Auto Bga Reballing Rework Station for Mobile Phone Small Chips

Best Quality Auto Bga Reballing Rework Station for Mobile Phone Small Chips photo-1
US$ 19,000 - 25,000 MOQ: 1 Piece
Key Specifications
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Place of Origin:
Guangdong, China
Brand Name:
DH
Model Number:
DH-A5
Payment & Shipping
Payment Methods:
Port of Shipment:
Shenzhen
Delivery Detail:
Delivery time depends on order quantity.
Place of Origin Guangdong, China
Brand Name DH
Model Number DH-A5
Voltage 220V, 50/60HZ
Current N/A
Rated Capacity N/A
Rated Duty Cycle N/A
Dimensions 70x90x95cm
Weight 112kg
Usage repair BGA/SMD, welding, mounting,desoldering and soldering
Certification CE, ISO9001
After-sales Service Provided Engineers available to service machinery overseas

Best quality auto bga reballing rework station  for mobile phone small chips

 

Product show:

 Best quality auto bga reballing rework station for mobile phone small chips Best quality auto bga reballing rework station for mobile phone small chips Best quality auto bga reballing rework station for mobile phone small chips

Best quality auto bga reballing rework station for mobile phone small chips

Accessories:

Best quality auto bga reballing rework station for mobile phone small chips

Specification:

Product name IR reballing kit
Total power 6700W
Top hot air heating 1200W
bottom heating bottom hot air heating 1200W, IR preheating 3900W
Power 220V, 50/60HZ
Temperature accuracy ±2°C
Positioning V-groove, PCB support can be adjusted in X,Y direction and equipped with the external universal fixture
PCB size min 22x22mm, max 450x490mm
BGA chips 2x2mm-80x80mm
Minimum chip spacing 0.15mm
External temperature sensor 5(optional)
N.W. 112kg
Dimension 70x90x95cm
Suitable motherboards mobile phone, laptop, desktop, PS3, XBOX360, game comsole,etc
Features

1.CCD camera optical alignment

2.automatic

3.laser positioning

4.PLC control

5.Temperature accuracy

Accessories

-1 piece user guide

-1 piece CD

-1 piece LCD display

-1 piece brush

-5 piece temperature sensor

-5 pcs hot air nozzle: top nozzle 3pc(31x31mm,38x38mm,41x41mm), Bottom nozzle 2pcs (34x34mm,55x55mm)PS: Hot air nozzle size can be customized according to your chip size

-1 set of vacuum slot including 4 sizes

-3 pcs vacuum sucker

-6 pcs universal fixture

-6 pcs plug knob

-4 pcs supporting screw

Main feature:

1.Embedded Industrial PC, high definition touch screen interface, PLC control, and instant profile analysis function. Real-time settings and actual temperature profile display can be used to analyzed and correct parameters if necessary.

2.It uses precise K-type close circuit control and automatic temperature adjustment system, with PLC and temperature module to enable precision temperature control of ±2 degC. External temperature sensor enables temperature monitoring and accurate analysis of real time temperature profile.

3.V-groove PCB support for rapid, convenience and accurate positioning that fits for all kinds of PCB board.

4.Flexible and convenient removable fixture on the PCB board which protectsand prevent damage to PCB. It can also adapt to rework various BGA packages.

5.Various sizes of BGA nozzles, which can be adjusted 360 degree for easy installation and replacement;

6.Three temperature areas can independently heat and are multiple controllable and adjustable to ensure best integration of different temperature areas. Heating temperature, time, angle, cooling and vacuuming can all be set on the interface.

7.There are 6-8 levels of variable and constant temperature controls. Massive storage of temperature curves which are Instant accessible according to different BGA. Curve analysis, setting and adjustment are all accessible via touch screen. Three heating areas adopts independent PID calculation to control heating process to enable more accurate and precise temperature control.

8.It uses high powered blower to enable fast cooling of PCB board and prevent it from deformation. There are also internal vacuum pump and external vacuum pen to assist with fetching the BGA chip.

9.High precision digital video registration system, rocker control.

10.Including Voice "early warning" function. 5-10 seconds before the completion of uninstalling or welding, voice reminder / warning to get the workers prepared. Cooling system will start after vertical wind stopped heating. When the temperature drops to room temperature, the cooling process will stop, so that the machine will not age after heated up.

11.CE certification, with emergency switch and automatic power-off protection device when emergency happens

Packing:

Best quality auto bga reballing rework station for mobile phone small chips

Our factory:

Best quality auto bga reballing rework station for mobile phone small chips

Welcome you to visit our factory:

Best quality auto bga reballing rework station for mobile phone small chips

CE and ISO9001 Certificate:

Best quality auto bga reballing rework station for mobile phone small chipsBest quality auto bga reballing rework station for mobile phone small chips

Payment:

We can accept Western Union, PayPal, T/T payment. If you want other payment methods, please kindly inform us.

Shipping:

1. The machine can be delivered by DHL, FedEx, TNT, EMS, UPS.

2. The delivery date is within 7 days after the receipt of payment.

Warranty:

1.All the machine will be well tested for 3 days before sending.

2.The whole machine is for 1-year warranty, the heating wire is for 3-years warranty

Feedback from our customers:

Best quality auto bga reballing rework station for mobile phone small chips

 Should you have any question, please feel free to contact me. Your inquiry will get our fast reply.

 

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Business Type
Manufacturer
Year Established
2011
Factory Size
1,000-3,000 square meters
Annual Export Value
US$2.5 Million - US$5 Million