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Help CenterBga Reballing Kit for Ps3 Laptop Motherboard Repair Reballing DH-A1L
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Specifications
1. Bga reballing kit2. 2 independent heating zones
3. PLC control
4. Powerful cross flow fan
5. high efficiency BGA repair
bga reballing kit for ps3 laptop motherboard repair reballing DH-A1L
Features:
1.Embedded Industrial PC, high definition touch screen interface, PLC control, and instant profile analysis function. Real-time settings and actual temperature profile display can be used to analyzed and correct parameters if necessary.
2.It uses precise K-type close circuit control and automatic temperature adjustment system, with PLC and temperature module to enable precision temperature control of ±2 degC. External temperature sensor enables temperature monitoring and accurate analysis of real time temperature profile.
3.V-groove PCB support for rapid, convenience and accurate positioning that fits for all kinds of PCB board.
4.Flexible and convenient removable fixture on the PCB board which protectsand prevent damage to PCB. It can also adapt to rework various BGA packages.
5.Various sizes of BGA nozzles, which can be adjusted 360 degree for easy installation and replacement;
6.Three temperature areas can independently heat and are multiple controllable and adjustable to ensure best integration of different temperature areas. Heating temperature, time, angle, cooling and vacuuming can all be set on the interface.
7.There are 6-8 levels of variable and constant temperature controls. Massive storage of temperature curves which are Instant accessible according to different BGA. Curve analysis, setting and adjustment are all accessible via touch screen. Three heating areas adopts independent PID calculation to control heating process to enable more accurate and precise temperature control.
8.It uses high powered blower to enable fast cooling of PCB board and prevent it from deformation. There are also internal vacuum pump and external vacuum pen to assist with fetching the BGA chip.
9.Including Voice "early warning" function. 5-10 seconds before the completion of uninstalling or welding, voice reminder / warning to get the workers prepared. Cooling system will start after vertical wind stopped heating. When the temperature drops to room temperature, the cooling process will stop, so that the machine will not age after heated up.
10.CE certification, with emergency switch and automatic power-off protection device when emergency happens.
Specification:
Power |
4900W |
Top heater |
Hot air 800W |
|
Bottom heater Iron heater |
Hot air 1200W, Infrared 2800W 90w |
Power supply |
AC220V±10% 50/60Hz |
Dimension |
650x680x600mm |
Positioning |
V-groove, PCB support can be adjusted in any direction with external universal fixture |
Temperature control |
K type thermocouple, closed loop control, independent heating |
Temp accuracy |
±2 degrees |
PCB size |
Max 500*400 mm Min 22*22 mm |
BGA chip |
2*2-80*80mm |
Minimum chip spacing |
0.15mm |
External Temperature Sensor |
1(optional) |
Net weight |
45kg |
Whole structure of BGA repair station DH-A1L
Hot air nozzles:
Vocuum pen for handling BGA chip:
Packing:
About our factory:
Certificate:
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