Infrared BGA Station Soldering

Specifications

1. Infrared BGA Station Soldering
2. 3 independent heating zones
3. PLC control
4. CE certificate

Infrared BGA Station Soldering

 

Features:

1.Embedded Industrial PC, high definition touch screen interface, PLC control, and instant profile analysis function. Real-time settings and actual temperature profile display can be used to analyzed and correct parameters if necessary.

2.It uses precise K-type close circuit control and automatic temperature adjustment system, with PLC and temperature module to enable precision temperature control of ±2 degC. External temperature sensor enables temperature monitoring and accurate analysis of real time temperature profile.

3.V-groove PCB support for rapid, convenience and accurate positioning that fits for all kinds of PCB board.

4.Flexible and convenient removable fixture on the PCB board which protectsand prevent damage to PCB. It can also adapt to rework various BGA packages.

5.Various sizes of BGA nozzles, which can be adjusted 360 degree for easy installation and replacement;

6.Three temperature areas can independently heat and are multiple controllable and adjustable to ensure best integration of different temperature areas. Heating temperature, time, angle, cooling and vacuuming can all be set on the interface.

7.There are 6-8 levels of variable and constant temperature controls. Massive storage of temperature curves which are Instant accessible according to different BGA. Curve analysis, setting and adjustment are all accessible via touch screen. Three heating areas adopts independent PID calculation to control heating process to enable more accurate and precise temperature control.

8.It uses high powered blower to enable fast cooling of PCB board and prevent it from deformation. There are also internal vacuum pump and external vacuum pen to assist with fetching the BGA chip.

9.Including Voice "early warning" function. 5-10 seconds before the completion of uninstalling or welding, voice reminder / warning to get the workers prepared. Cooling system will start after vertical wind stopped heating. When the temperature drops to room temperature, the cooling process will stop, so that the machine will not age after heated up.

10.CE certification, with emergency switch and automatic power-off protection device when emergency happens.

 

Specification:

 

Power supply	AC220V±10% 50/60Hz
Power	6500W
Top heater	Hot air 1200W
Bottom heater	Hot air 1200W, Infrared 3900W
Positioning	V-groove, PCB support can be adjusted in any direction and with external universal fixture
Temperature control	K sensor closed loop control, independent heating
Temp accuracy	±2°C
PCB size	Max 500*400 mm Min 22*22 mm
Workbench fine-tuning	±15mm forward/backward, ±15mm right/left
Placement Accuracy	±0.01MM
Camera magnification	10x-100x
BGA chip	2*2-80*80mm
Minimum chip spacing	0.15mm
External Temperature Sensor	1-5(optional)
Machine dimension	(L*W*H): 670*770*750mm
Packing dimension	(L*W*H): 80*90*90cm
NW/GW	78/98 KG

 

Whole structure of BGA repair station DH-A3

 

Hot air nozzles:

 

Vocuum pen for handling BGA chip:

Packing:

 

About our factory:

 

Certificate: