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Help CenterDH-A3 Laser Alignment Bga Chip Replace Machine
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Specifications
laser alignment bga chip replace machineHD Optical Alignment
3 independent heating zones
HD touch screen interface
DH-A3 laser alignment bga chip replace machine
Specifications of bga chip replace machine:
Power supply |
AC220V±10% 50/60Hz |
Power |
6500W |
Top heater |
Hot air 1200W |
Bottom heater |
Hot air 1200W, Infrared 3900W |
Positioning |
V-groove, PCB support can be adjusted in any direction and with external universal fixture |
Temperature control |
K type thermocouple, closed loop control, independent heating |
Temp accuracy |
±2℃ |
PCB size |
Max 500*400 mm Min 22*22 mm |
Workbench fine-tuning |
±15mm forward/backward, ±15mm right/left |
Camera magnification |
10x-100x |
BGA chip |
2*2-80*80mm |
Minimum chip spacing |
0.15mm |
External Temperature Sensor |
1-5(optional) |
Placement Accuracy |
±0.01MM |
Machine dimension |
(L*W*H): 67*77*75cm |
Packing dimension |
(L*W*H): 80*84*80cm |
NW/GW |
approx 80/112 KG |
A3 Main Features of bga chip replace machine:
lHD touch screen interface, PLC control
lHD color optical alignment system, optical zoom up to 30 times. Alignment can move around to enlarge BGA observation range, fine-tuning accuracy can be 0.01mm
lThree independent heaters all can set 8 segments heating, cooling and constant temperature, saved temperature profile is unlimited. IR preheat area can be controlled according to PCB size
lK sensor close loop control and automatic temperature compensation system. It combines with
temperature module, which enables temperature accuracy to ±2°C
lHot air nozzles, 360 degree rotation, easy to install and replace, customized is available.
lV-groove PCB support for rapid, convenience and accurate positioning that fits for all kinds of PCB board.
lPowerful cross flow fan, cooling the PCB board efficient after heating, to prevent it from deformation.
lSound hint system. There is an alarm before the completion of each desoldering and soldering.
lCE certification, with emergency switch and automatic power-off protection device when emergency happens
More photos of bga chip replace machine:
Payment terms:
T/T;Western Union;Paypal;Escrow
Warranty:
1.All the machine will be well tested for 3 days before sending.
2.The whole machine is for 1-year warranty, the heating wire is for 3-years warranty.
Packing & Delivery:
1. The machine can be delivered by DHL, FedEx, TNT, EMS, UPS.
2. By sea or by air. Please provide us your nearest port.
3. The delivery date is within 7 days after the receipt of payment. If you are in urgent need of it,please kindly tell us.
Certification:
Company profile:
Our compay
Our customer
Chip bond FAQ:
1. Missing solder
It will cause the off-normal with the manual counterpoint, and there will be a process of automatic correction between welding plate and the bga chip under the effect of the surface tension of the solder ball.
Chip uneven decline result from the uneven heating, or the early returning result in the run-off. If stop the reflow at this time, it will cause the missing solder. So we need to extend the time of soldering temperature. Or we also can increase the soldering temperature to make the degradation of the solder ball uniformity.
2. Short circuit.
When the solder ball arrive in the melting point and is at the status of liquid, the higher time,temperature and pressure will damage the surface tension and supporting role of the solder ball. And then resulting the short circuit. So we need to cut down the time of soldering appropriately, or we can lower the soldering temperature.
3. A chip burst and bubble.
General there will be three situation;
1) First, Chip be affected with damp.
Solution:put the BGA and PCB into the oven about 4 to 8 hours, the temperature of oven setting is 80℃ to 100℃
2) Second, higher temperature
Solution: cut down the soldering time and turn up the bottom temperature to avoid chips directly heated too high.
3) Longer solder time
Solution: cut down the soldering time or move up the upper area a little. And let the bottom heat first, when the bottom temperature is 200 degree, move back the upper area. It can avoid the chip to heating too long.
4. Why the PCB will become black after soldering
General there will be two situation;
1) First,too much repeat welding times
2) Second, there is the problem of the flux paste quality.
Solution: use the better quality flux paste.
5. Why there will be the four corners rugged after the soldering.
General there will be two situation;
1) First, the PCB is not to be installed well or the PCB is out of shape.
Solution: after installing the PCB well. Please check that whether they are on the same line. And adjust the supporting screw to prevent the PCB sinking.
2) Second, the heat absorption rate of the bonding pad inconsistent res lutin1y5netdhcom
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