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Home > Manufacturing & Processing Machinery > Laser Equipment > Laser Welding Machine > Dinghua Optical Alignment Bga Rework Machine Soldering Maching for Mobile Phone With Optical Bga Reballing Kit DH-A5
Dinghua Optical Alignment Bga Rework Machine Soldering Maching for Mobile Phone With Optical Bga Reballing Kit DH-A5
US$ 5,000 - 30,000
MOQ: 1 Set
Key Specifications
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Place of Origin:
Guangdong, China
Brand Name:
DINGHUA
Model Number:
DH-A5
Payment & Shipping
Payment Methods:
Port of Shipment:
shenzhen/Hongkong
Delivery Detail:
Delivery time depends on order quantity.
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Place of Origin
Guangdong, China
Brand Name
DINGHUA
Model Number
DH-A5
Voltage
AC220V±10% / 110V 50/60Hz
Current
30A
Rated Capacity
2800W
Rated Duty Cycle
100%
Dimensions
approx 730x670x940mm
Weight
Approx 91KG
Usage
bga rework station soldering maching for mobile phone
Certification
CE ISO 9001 2008 ROHS
After-sales Service Provided
Engineers available to service machinery overseas
Dinghua optical alignment bga rework machine soldering maching for mobile phone with optical bga reballing kit DH-A5
Specification:
- Total Power: 6800W
- Top heater: 1200W
- lower heater: 1200W
- Bottom heater: 4200W
- power: AC220V/AC110 optional
- Positioning: V-groove, PCB support
- Temperature control: K Sensor, Closed loop
- Temp accuracy: ±1 degree
- Workbench fine-tuning: ±15mm forward/backward ±15mm right/left
- Placement accuracy: ±0.01mm
- Camera magnification: 10x-220x
- PCB size: Max 420x470mm Min 20x20mm
- BGA chip size: 2*2~80*80mm
- Minimum chip spacing: 0.15mm
- Dimension: approx 730x670x940mm
- Net weight: Approx 91KG
Feature:
Humanized design:
- Most advance Panasonic servo driver used, fully automatic pick, placement, soldering / desoldering, and cooling.
- Two operation mode: manual and automatic. Auto mode: auto pick, placement, soldering / desoldering and cooling with one button. Manual mode: Manual up/down top head to soldering/desoldering bga with joysticks.
- Both two operation modes combines with optical alignment and laser positioning to finish the process. Meanwhile, build-in vacuum can pick up bga chip conveniently.
- Plus size pcb table, suitable for all kinds of pcb repairing.
- 5pcs different sizes vacuum sucker for bga picking.
- Top air speed adjustable function, prevent tiny bga from movement when heating.
- Embedded with Industrial PC + Intelligent temperature module, Stable and reliable.
- Windows OS interface in English and Chinese + USB interface, easy operate.
- With 5 different size of nozzles: upper: 31*31mm, 38*38mm,41*41mm. Bottom: 34*34mm 55*55mm
- Any size of nozzle can be custom, Titanium alloy material, never deformation, never rusty.
- Adopt three heating zone, upper heater and lower heater are hot air, bottom is infrared preheat zone.
- High power cross flow fan, fast cooling the pcb, prevent it from deformation.
Accurate temperature control:
- Three independent temperature heating + PID self setting adjusted + PLC control to ensure temperature accuracy will be on ±1°C
- It can set 8 segments heating, and massive storage of groups temperature profile.
- Setting BGA heating curve conveniently and index search.
- Automatic temperature curve analysis.
Convenient visual alignment:
- Laser positioning, fast and accurate position of pcb and bga on the machine.
- Optical alignment system + CCD color lens system
- 2 color separation, magnification, micro adjustment
- Auto focus, auto correction, auto color differentiation.
- Light brightness adjustment system.
- Japan Panasonic camera can move frontward / backward, right / left automatically.
- Built-in vacuum sucker, pick up the bga chip conveniently after desoldering.
Precision components:
- Precise fine-tuning knob of bga chip, adjust angle of bga chip to align.
- X, Y , Z micrometers fine-tuning, Placement accuracy will be ±0.01 MM.
- V-groove clamp + universal fixture suitable for all kinds of PCB.
- Hot air nozzle with magnet, rotate in any angle, easy replace and operate.
- Heating system and placement head 2 in 1 design, precise positioning.
Perfect security design:
- With fan failure protection, thermocouple failure protection function.
- Overheating protection, emergency stop function.
- Start up password and modify protection.
Application:
Suitable for all kinds of BGA repairing (CCGA,BGA,QFN, CSP,LGA,Micro SMD,MLF...)
Lead and Lead-free
Packing:
Certification:
Why our machine more accurate?
Our machine use PID control, the data acquisition frequency of our machine is 10ms(which means every 10ms the PID will grab the data to correcting the temperature, but for most of BGA rework station from other companies, their PID grab frequency is 30ms, this is a big difference between 10ms and 30ms, that's why our machine is more accurate.
Our company:
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Business Type
Manufacturer
Year Established
2011
Factory Size
1,000-3,000 square meters
Annual Export Value
US$2.5 Million - US$5 Million
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